Professional Experience
2012-2013 Consultant at Don’s Material Development - DMD
2012-2012 Polyera Corp.
· 2012-Nov 2012 Research Fellow – Project Leader
o Managed Metal Oxide Project: Team in Skokie and Zhubei, Taiwan.
o Managed Development of IGZO and Polymer Dielectric Materials.
o Develop new Business for Polyera.
2007-2012 Henkel Electronics & Ablestik Electronics
2010-2012
· Sr. Research Scientist
o TLPS & Silver metal bonding.
o Epoxy, Acrylate & other New Resin Hybrid Materials for Mold Compound and Dielectric applications.
o Adhesives for Corrosive Environments.
o Working with outside companies to bring in new technology we needed for new business development.
o Creating new business areas for product development.
2008-2010
· Sr. Development Scientist
o Directed Team developing new Non-conductive Paste materials used for 3D bonding and Copper Pillar Bonding. Project successful and lead to multimillion dollar product lines.
o This work included building bridges with outside tool vendors and developing business alliances.
o Lid Seal Adhesive
2007-2008
· Sr. Business Scientist (while part of Ablestik)
o Managed Team to Develop New Wafer Level Materials.
o Develop new Business using Wafer Level Materials.
1989 – 2007 The Dow Chemical Company.
1997-Present: Application Development Manager; Semiconductor Fab Materials.
· Developing new materials and business relationships for semiconductor applications.
o New dielectric materials.
§ SiLK D – New low-k dielectric that had better reliability and processing
§ Ensemble PMD – An inorganic material used as a FEOL pre-metal dielectric.
§ Managed key customers’ needs and programs.
§ Worked to create and manage our SiLKnet Alliance, I managed the clean division. SiLKnet Alliance was a business development group that linked Dow’s Materials with Tool vendors’ process knowledge. We also linked with complimentary materials development companies.
o New Patterning and BARC films business development and material development.
§ SiLK S – New version acted as a high carbon etch mask.
§ Ensemble ARC® - Hybrid material with a tunable k value.
· Managed the technical support for our customers.
· Ran technical and business development programs at our customers to integrate our material into their processes.
· Building and providing the material science knowledge to successfully use our materials.
1995-1997: Research Leader; Process & Business Development
· Business development for advanced packaging using advanced materials.
· Developed pricing strategies, prepared market needs analysis and recommended areas for R&D effort based upon cost & process model analysis.
· Worked with several consortiums on the cost analysis of new products and new manufacturing processes.
· Directed a team to develop several generations of our cost model software (EnVision).
o The Software was later distributed by Techsearch International.
1992-1995: Project Leader; Packing & Interconnect Materials Technical Support for Asian Accounts.
· Provided technical support to our customers in Asia; including, Single and Multi-Chip packaging, Silicon, GaAs, LCD and some ceramic applications.
· Developed new materials process techniques.
· Reformulated old products to meet customer needs.
· Directed teams working on specific customer solutions, developed cost model software, and worked closely with our customers.
1990-1992: Sr. Chemist; Research and Development of Electronics Materials.
· Developed new electronics polymers processing techniques, mathematically modeled existing processes.
· Developed material performance measures, and solved several customer adhesion challenges.
· Developed two different adhesion measuring devices, one of which is currently being sold by the Quad Group.
1989-1990: Chemist; Rotation Assignments Program.
· Developed new gas separation membranes.
· Developed ceramic armor for military applications.
· Developed dielectric characterization techniques for low dielectric constant materials.
· Developed packaging systems for consumer food products.
Consulting, Business Development and Advisory Activities:
IEEE CPMT Orange County Chapter (Volunteer work)
2011 – 2012 Vice Chairman of the IEEE CPMT OC Chapter
IMEC (Interuniversitair Micro-Elektronica Centrum), Belgium
2011 – 2012: Director of Henkel’s membership in the IMEC’s Industrial Affiliation Program for 3D packaging
GaTech, Atlanta
2010 – 2012: Henkel’s Program Manager of 3D Systems Packaging Research Center, Interposers
Institute of Microelectronics, Singapore
2001 – 2005: Member of Technical Advisory Board for “Back End of Line Ultra-low K Interconnect, WTC program”.
2000 – 2002: Member of Technical Advisory Board for “CopBond Program for Wirebonding on Copper Interconnect”.
University of Albany, State University of New York
2000 – 2001: Program Director of the “Cu-Barrier Processing Studies of SiLK® Program”.
Ecole Polytechnique, Montreal, Canada
1999 – 2001: Program Director of the “BCB to Nobel Metal Interface Program”.
Professional Awards & Conference Leadership
2011 Technical Program Chairman for the 3D Workshop at IEEE CPMT OC, Irvine
2011 Technical Chair for the Underfills, Mold Compound and Dielectrics at ECTC, Orlando.
2010 Technical Chair for Emerging Technologies at ECTC, Las Vegas.
2009 Technical Chair for Materials and Processing at ECTC, San Diego
2007 Dow Diamond Award for Electronic Business Success.
2007 Special Recognition Award for Excellent Customer Service to TI.
2006 AVS ICMI Technical chair for session on Contact and Interconnect Stack Engineering.
2005 ITRS Interconnect Committee member for future Interconnect.
2005 AVS ICMI Session leader for The Advance Dielectrics Session.
2002 Special Recognition Award for creating the SiLKnet alliance.
2000 Development Scientist Award for Best New Inventions of Dow.
1996 Special Recognition Award for directing and supporting our laboratory during the Dow Workstation Transition.
1996 Project Award for first commercial qualification of Photo-BCB.
1995 Milestone Award for Photo-BCB.
1995 Special Recognition Award for developing the Envision™ Cost Model.
1994 Special Recognition Award for obtaining the CILAP ARPA contract.
1994 Outstanding Paper of Conference Award, ICMCM Denver MCM Conference.
1993 Special Recognition Award for outstanding support of our Asian Customers.
Education
1983 – 1989 University of Pennsylvania
· Ph.D. in Physical Chemistry-Laser Spectroscopy of medium size molecules.
· Thesis: “Stimulated Emission Spectroscopy of Glyoxal and the Glyoxal-Ar van der Waals Complex” Advisor: Hai-Lung Dai
· Thesis study involved general physical chemistry curriculum with heavy emphasis on physics. Taught introductory and advanced classes.
· Built and operated several laser laboratories using advanced electronic devices.
· Directed and assisted junior students in Hai-Lung Dai’s lab.
1979 – 1983 Illinois State University
· B.S. in Math and Chemistry with a minor in Physics
· Undergraduate research in Physical Chemistry. Honors program graduate with many awards. Took many graduate math courses during my B.S. degree program and qualified for the Intensive Math Degree.
Summary of Qualifications
· Extensive customer relationships in Japan, Korea, Taiwan, and the United States.
· Expert in semiconductor process for BEOL.
· Extensive knowledge in developing materials for FEOL.
· Expert in advanced electronic packaging, interconnects, and MultiChip Modules.
· Expert in the electronics industry especially for the use of polymers in electronic devices.
· Experienced in working within the Japanese, Korean, Chinese and Taiwanese cultures.
· Completed Innovation Training at IESE, Barcelona Spain 2010
· Experienced in using needs based analysis.
Trained in Conceptual Selling, account management (“Large Account Management ProcessÒ” Miller Heiman) and other sales and support techniques.
· Working knowledge of most electronics processing equipment.
· Completed three graduate level polymer courses while at Dow Chemical.
· Instructor at Dow Chemical for “Applying Statistical Methods”.
· Routinely uses statistical Design of Experiments.
· Experienced in using Visual Basic, Visual Basic for Applications, and Database programming.
· Developer of Expert Systems using Case Based Reasoning.
· Took several MBA courses at Central Michigan University.
· Expert in using the SEMI standard Cost of Ownership model.
Selected Patents and Publications
1. Patent Pending, 2012
2. Patent Pending, 2012
3. “Materials Advances Enable Thinner Packages”, IMAPS Think Thin, Santa Clara CA 2011.
4. “Gold-Gold Interconnects to Copper Pillar using fast Thermal Compression Bonding using Non-conductive paste”, Presented at ECTC, Las Vegas 2010.
5. “Front side protection layer for improved reliability of wafer-level packages”, Presented at ECTC, San Diego 2009.
6. One patent pending, filed internationally.
7. Patent: US5668210: Adhesion promoter and self-priming arylcyclobutene resin compositions granted in 1997 and filed internationally.
8. “Hybrid Porous and Dense Dielectric Stacks - BEOL Process Integration for 65 and 45 nm nodes”, Invited presentation at VMIC Fremont, CA 2005.
9. “Patterning Films for DRAM and Flash”, Invited talk at AVS ICMI, Santa Clara, CA 2005.
10. “Low k Materials for ULSI Applications”, Invited presentation at International Metrology Conference, Dallas, TX 2005.
11. “Compatibility of an All Spin-On Dielectric Process for Cu Dual Damascene BEOL.” Invited presentation at the International Conference on Microelectronics and Interfaces in Sunnyvale, CA 2003.
12. “Ultra-Low k Spin-on Polymer, Benefits, Challenges and Solutions for Damascene Integration.” Present at the AVS Thin Film users group, Oct 2002.
13. “Packaging Challenges for Advanced Low-k for Flip chip and Wirebonding.” Invited Presentation at Kulicke & Soffa’s Symposium 2002.
14. “Clean Challenges for Low-k & Ultra Low-k Dielectrics.” Invited Presentation at the FSI Technology Symposium 2002.
15. “Clean & Low K Update, Wet and Dry.” Invited Presentation at the Axcelis Technology Symposium 2002.
16. “Cu/SiLK dielectric & Al-W/SiLK* dielectric integration for deep sub-micron interconnect technologies.” Presented Semicon Korea in Seoul 2001.
17. “Physical and Interfacial Properties of Low Permittivity Polymers: SiLK* and Ultra-Low K.” Presented and Published at the ACS Workshop on Polymer Metallization in Montreal 2001.
18. “Cost Implications of Large Area MultiChip Modules Processing.” This presentation and paper won an outstanding paper of conference award at the 1994 International Conference on MultiChip Modules (ICMCM).
19. “Review of BenzoCycloButene (BCB).” Presented at 1993 SPIE conference in Japan.
20. “Economic Evaluation of Deposited Dielectrics MCM Manufacturing Cost.” Presented at 1993 ICMCM.
21. “Photodefinable Benzocyclobutene Formulations for Thin Film Microelectronics Applications III.” Presented at 1993 MRS conference.
22. “Adhesion of Cyclotene® (BCB) to Silicon Substrates.” Presented at 1993 MRS conference.
23. “Perfluorocyclobutane Aromatic Ether Polymers”, Polym. Prepr. (1993), 34, 413-14.
24. “Via Generation in BCB.” Presented at 1992 VLSI Packaging Conference in Kyoto Japan.
25. “Photodefinable Benzocyclobutene Formulations for Thin Film Microelectronics Applications.” Presented at the 1992 IEPS conference.
26. “Using Statistics in the Design of Experiments.” A paper in Scientific Computing, 1992.
27. “Isomeric structures and van der Waals Vibrational Frequencies of Glyoxal-Argon Complexes,” J. Chem Phys. (1992), 96, 2703-16.
28. “Laser Vibrational Spectroscopy of Transient, Weakly Bound, and Reactive Molecules”, Applied Spectroscopy, Volume 44, Number 10, December 1990, pp. 1595-1604(10)
29. “Structure and van der Waals Vibrational Frequencies of the Glyoxal-Ar2 Complex Studied by Fluorescence Excitation and Stimulated-Emission Spectroscopy.” J. Opt. Soc. Am. B, 1990.
30. “Vibration-Rotation Spectroscopy by Stimulated Emission Pumping in Supersonic Beam: a-axis Coriolis Coupled v4=1 and v8 = 1 Levels,” J. Chem. Phys. 89 (1988) 2609.
31. “Stimulated Emission Spectroscopy of van der Waals Vibrational Levels of Glyoxal (X1Ag)-Argon”, J. Chem. Phys. 88 (1988) 7240-1.
32. “Polarized Stimulated Emission Pumping. Chem. Phys. Letter. 133 #3 (1987) 249.
33. “Equilibrium Rate Constants for Ion Association in Liquid Ammonia,” J. Phys. Chem 88 (1984) 1854-7.