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Welcome and let me be your Consultant for all your material needs!

I have over 30 years of experience in electronic materials formulation, new business development, and market analysis. Industrial experience at Polyera (TFT Startup), Henkel/Ablestik(Large Adhesive and Speciality), and Dow Chemical(Large General Chemical). Across several areas:

Material & Process Development for:

1. Wafer Fabrications BEOL Low K dielectrics

a. Low K Dielectrics and Deposition

b. Advanced Patterning Schemes using Organic and Inorganic options

2. Advanced Packaging

a. 3D

b. Flip Chip

1. Fan in

2. Fan out

c. Copper Post - Thermo-compression bonding

d. Wafer Level coatings

e. Au-Au bump bonding

f. Underfills

e. Reconstituted Wafers

f. Adhesives

g. Temp Adhesives

3. Display

a. Glass coatings

b. TFT structure

c. Flexible displays

d. Dielectrics

e. Metal Oxides

See my about page for my full biography and skills.