Capabilities
we serve our national and international users with the following capabilities from our team!
Pulsed laser epitaxy
Deposit epitaxial thin films, heterostructures, multilayers, superlattices, and nanocomposite films with desired properties including superconductivity, ferroelectricity, piezoelectricity, and ferromagnetism.
Capabilities include:
Over 500 ceramic targets of oxides, metals, other compounds.
Four pulsed-laser deposition systems for thin film growth.
One PLD chamber designed for actinide thin film synthesis.
Reflection high-energy electron diffraction (RHEED) for in-situ growth monitoring.
Combinatorial high throughput thin film synthesis.
Five PLD chambers for different materials
Thin film X-ray diffractometer (Rigaku Smartlab)
Capabilities include:
Powder diffraction.
Thin film metrology (Phi scan, Omega scan, Pole Figure, Reciprocal Space Map, etc.).
In-plane diffraction (for ultrathin films).
Domed Cooling/heating Stage for Four-Circle Goniometers (Temperature range from -180 °C to +500 °C).
High resolution and high speed 2D detector.
Automated instrument control and measurements.
Physical Properties Measurement system (PPMS)
Capabilities include:
Sample environment controls include fields up to ±9 T and a temperature range of 1.9–400 K.
Expandable design makes the PPMS the most versatile system of its kind.
DC resistance; van der Pauw — Hall Transport
Vibrating Sample Magnetometer (VSM); AC Susceptibility (ACMS II)
Heat Capacity
Multi-Function Probes
Electronic Device Characterization
Characterization equipment for electronic devices in controlled environments and temperature (light pulse, gas flow, temperature, etc) allows users to investigate electronic devices for different functional applications, including memory storage and neuromorphic computing.
Suitable materials include dielectric, ferroelectric, insulating, and semiconducting thin films and devices.
Test ferroelectric and dielectric thin films and capacitors at different temperatures for current voltage (I-V), polarization voltage (P-E), capacitance voltage (C-V), capacitance frequency (C-f), etc.
Temperature stage (-195oC–600oC).
MJB4 Mask Aligner
The MJB4 is widely used for MEMS and optoelectronics applications, such as LED production. It can be specifically configured for nonstandard substrates such as hybrids and high-frequency components for fragile III-V materials.
Double-tilt in-situ TEM holder (Protochips Fusion Bias+heating holder)
The double-tilt Fusion Select TEM holder is designed for in-situ biasing and heating experiments in TEM for high solution imaging.
Conventional TEM sample pre
Tripod Polisher
Dimple Grinder
M-Prep 5x™ Grinder/Polisher
Ion milling (shared)
Ceramic pellets fabrication
Furnace
Hydraulic Pellet Press
Powder Pressing Die Set, etc
Dektak 150
Shared facilities
nanofab
TEM (Titan, Spectra, etc)
FIB etc.