Ibrahim Raafat Mostafa

Week X: Make-through

This is my make-through for the week's assignment. Grab a cup of coffee!

PROCESS MAP

OBJECTIVE #1: PCB design and fabrication

#1 : Schematic and board layouts design

Step#2 : PCB fabrication

Step #3 (Successful): PCB Soldering

OBJECTIVE #2: DIP-RGB Assignment

OBJECTIVE #2: Thermistor-High power LED

Trial #1 (Unsuccessful): Can't find the problem yet

Trial #2 (Unsuccessful): Can't find the problem yet again

BACKGROUND

OBJECTIVE #1: PCB design and fabrication

#1 : Schematic and board layouts design

Eagle files

Problem:

Potential Solution:

Step#2 : PCB fabrication

PNG fabrication files

Step #3 (Successful): PCB Soldering

OBJECTIVE #2: DIP-RGB Assignment

CODE.INO

OBJECTIVE #2: Thermistor-High power LED

Trial #1 (Unsuccessful): Can't find the problem yet

CODE.ino

Trial #2 (Unsuccessful): Can't find the problem yet again

CODE.ino

CONCLUSION

What I learned this week is...

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