The ultimate foundation for high-reliability semiconductor packaging. Our lead frames deliver exceptional coplanarity, zero-warpage performance under thermal stress, and maximum delamination resistance.

1. Superior Thermal Dissipation

The heavy copper heat slug is directly riveted to the frame creates a massive, uninterrupted highway for thermal transfer. It handles localized heat spikes from high-power chips far better than a standard thin lead frame.

2. Exceptional Delamination Resistance

In standard semiconductor packages, smooth plastic molding compounds can peel or separate from flat copper frames under thermal cycling (delamination). The riveted mechanical locking mechanism physically pins the components together, completely eliminating the risk of internal layer separation.