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The ultimate foundation for high-reliability semiconductor packaging. By combining precision molding with robust riveting technology, we help you deliver flawless device performance while boosting your production efficiency.
1. The Core Metals
Copper Alloys (e.g., C194, C7025)
Iron-Nickel Alloys (specifically Alloy 42)
2. The Surface Plating (The Outer Layers)
Silver (Ag
Gold (Au) & Palladium (Pd)
Tin (Sn) or Tin-Silver-Copper (SAC)
OTHER VERSIONS
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