NCSU Nanofabrication Facility (NNF)
The NCSU Nanofabrication Facility is located in the Larry K. Monteith Engineering Research Center and provides users with a broad range of instruments in a 7,400-square-foot class-100/1000 clean room to support a diverse set of projects. The facility is open to all academic institutions, government labs and industry. The facility has a full range of micro and nano-fabrication capabilities including: photolithography, reactive ion etching (RIE), deep RIE, low pressure chemical vapour deposition (LPCVD), plasma enhanced CVD, rapid thermal anneal, thermal oxidation, solid source diffusion, thermal and e-beam evaporation, sputtering, chemical mechanical polishing, various wet etching and cleaning processes, along with various characterization tools. The NNF is capable of processing on a broad range of substrates such as semiconductors, ceramics, plastics and glass with sizes from small pieces to 6” wafers.
In addition to offering affordable access to state-of-the-art semiconductor fabrication equipment, the NNF provides personalized training on operation of equipment by experienced staff, teaching laboratories for undergraduate and graduate courses, and infrastructure for design projects, workshops, tours and research experiences. It also serves as a melting pot for a community of top-notch researchers from academia, government labs and industry.
Please visit the NNF site for more information: https://nnf.ncsu.edu/
Research Triangle NanoTechnology Network (RTNN)
The Research Triangle Nanotechnology Network is a partnership between North Carolina State University, the University of North Carolina at Chapel Hill, and Duke University (Duke). Collectively, our institutions house nine core nanotechnology fabrication and characterization facilities and over 100 principal faculty whose research encompasses broad aspects of nanotechnology. The vision of the RTNN is to be a national focal point for enabling innovative nanoscience and nanotechnology research, discovery, workforce development and education through (1) open access to cutting-edge fabrication and characterization facilities, (2) engagement of user populations with diverse research expertise to support the development of new processes and tools, and (3) innovative training and outreach programs.
RTNN technical capabilities span nanofabrication and nano-characterization of traditional hard, dry materials (e.g., 2D and 3D nanomaterials, metamaterials, photonics, and heterogeneous integration) and emerging soft, wet materials (e.g., tissue, textile, plant, and animal nanomaterials).
NCSU Analytical Instrumentation Facility (AIF)
The Analytical Instrumentation Facility (AIF) is NC State’s primary shared facility for materials characterization — with a mission to enable and lead state-of-the-art research through acquisition, development, maintenance, training, and access to major analytical and materials characterization instrumentation. Through the support of engaged faculty and experienced staff, the AIF supports state-of-the-art scanning and transmission electron microscopes, X-ray scattering and spectroscopy instruments, mass spectrometry, scanning probe and Raman microscopy, nanoindentation, and extensive sample-preparation facilities. Some of the extraordinary capabilities of these instruments include chemically sensitive atomic-scale imaging, extreme-resolution SEM of insulating and soft materials, in situ high-temperature and electric-field-dependent X-ray diffraction, cryogenic SEM of biological and soft materials, and in situ microscopy during heating, electrical current, immersion in fluids, and in flowing gases — to name a few. The AIF is positioned within the College of Engineering.
Commercial Leap Ahead for Wide Bandgap Semiconductors (CLAWS)
The regional hub, "Commercial Leap Ahead for Wide Bandgap Semiconductors," or CLAWS, led by North Carolina State University, includes one university partner, N. C. A&T State University, as well as six industry partners: MACOM, Coherent Corp., General Electric, Bluglass, Adroit Materials and Kyma Technologies, Inc.
The funding is part of $238 million invested through the “Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act” for the establishment of eight Microelectronics Commons regional innovation hubs spread across the United States.
Wide bandgap semiconductors offer higher voltage and temperature capacity than traditional silicon chips. They are used in power electronics, but also in RF and wireless devices for communications and radars, as well as photonic devices for sensing, communications, artificial intelligence, and future quantum technology applications. The hub will also explore next-generation ultra-wide bandgap materials with even greater voltage and temperature capabilities, including diamond and gallium oxide electronics.
Focus Areas:
Silicon Carbide Electronics
III-N RF Electronics
III-N Photonics
III-N Power Electronics
Ultrawide Bandgap Electronics
HIP Lab Facilities
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