Book Chapters
N. Zins, Y. Zhang, C. Yu, and H. An, "Neuromorphic Computing: A Path to Artificial Intelligence Through Emulating Human Brains," in Frontiers of Quality Electronic Design (QED): Springer, 2023, pp. 259-296.
N. Zins, Y. Zhang, and H. An, ‘Implementation of Associative Memory Learning in Mobile Robots Using Neuromorphic Computing’, Neuromorphic Computing. IntechOpen, Feb. 24, 2023. doi: 10.5772/intechopen.110364.
H. An, K. Bai, and Y. Yi, “The Roadmap to Realize Memristive Three-Dimensional Neuromorphic Computing System,” in Advances in Memristor Neural Networks-Modeling and Applications: IntechOpen, 2018.
Journal Articles
Liu, Tianze, Kang Jun Bai, and Hongyu An. "Replicating Associative Learning of Rodents with a Neuromorphic Robot in an Open-Field Arena." Frontiers in Neuroscience 19: 1565780.
Fabiha Nowshin, Hongyu An, and Yang Yi. 2023. Towards Energy-Efficient Spiking Neural Networks: A Robust Hybrid CMOS-Memristive Accelerator. ACM Journal on Emerging Technologies in Computing Systems, December 2023. https://doi.org/10.1145/3635165.
Md Abu Bakr Siddique, Yan Zhang, and Hongyu An. "Monitoring Time Domain Characteristics of Parkinson's Disease using 3D Memristive Neuromorphic System." Frontiers in Computational Neuroscience, Volume 17, 2023. DOI: 10.3389/fncom.2023.1274575.
H. An, M. S. Al-Mamun, M. K. Orlowski, L. Liu and Y. Yi, "Three-dimensional Neuromorphic Computing System with Two-layer and Low-variation Memristive Synapses," in IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), doi: 10.1109/TCAD.2021.3061481.
H. An, Mohammad Shah Al-Mamun, Marius K. Orlowski, Lingjia Liu, Yang Yi, “Robust Deep Reservoir Computing through Reliable Memristor with Improved Heat Dissipation Capability,” IEEE Transactions on Computing Aided Design of Integrated Circuits and Systems (TCAD), 2020.
H. An, Qiyuan An, Y. Yi, “Realizing Behavior Level Associative Memory Learning through Three-dimensional Memristor-based Neuromorphic Circuits”, IEEE Transactions on Emerging Topics in Computational Intelligence, 2019.
M. A. Ehsan, H. An, Z. Zhou, and Y. Yi, “A Novel Approach for using TSVs as Membrane Capacitance in Neuromorphic 3D IC,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2017
H. An, M. A. Ehsan, Z. Zhou, F. Shen, and Y. Yi, “Monolithic 3D neuromorphic computing system with hybrid CMOS and memristor-based synapses and neurons,” Integration, the VLSI Journal, 2017.
H. An, J. Li, Y. Li, X. Fu, and Y. Yi, “Three-dimensional memristor-based neuromorphic computing system and its application to cloud robotics,” Computers & Electrical Engineering, vol. 63, pp. 99-113, 2017.
Conference Papers
T. Liu, M. A. Bakr Siddique and H. An, "Mimicking Associative Learning of Rats via a Neuromorphic Robot in Open Field Maze Using Spatial Cell Models," 2024 International Conference on Neuromorphic Systems (ICONS), Arlington, VA, USA, 2024, pp. 299-306, doi: 10.1109/ICONS62911.2024.00052.
Noah Zins, and Hongyu An. "Reproducing Fear Conditioning of Rats with Unmanned Ground Vehicles and Neuromorphic Systems." In 2023 24th International Symposium on Quality Electronic Design (ISQED), pp. 1-7. IEEE, 2023.
Z. Kerman, C. Yu, and H. An, "Beta Oscillation Detector Design for Closed-Loop Deep Brain Stimulation of Parkinson’s Disease with Memristive Spiking Neural Networks," 2022 23rd International Symposium on Quality Electronic Design (ISQED), 2022, pp. 1-6, doi: 10.1109/ISQED54688.2022.9806207.
H. An, M. S. Al-Mamun, M. K. Orlowski and Y. Yi, "A Three-dimensional (3D) Memristive Spiking Neural Network (M-SNN) System," 2021 22nd International Symposium on Quality Electronic Design (ISQED), 2021, pp. 337-342, doi: 10.1109/ISQED51717.2021.9424303.
H. An, K. Bai, and Y. Yi, "Three-dimensional Memristive Deep Neural Network with Programmable Attention Mechanism," 2021 22nd International Symposium on Quality Electronic Design (ISQED), 2021, pp. 210-215, doi: 10.1109/ISQED51717.2021.9424331.
H. An, Dong Sam Ha, and Yang Yi. "Powering next-generation industry 4.0 by a self-learning and low-power neuromorphic system." In Proceedings of the 7th ACM International Conference on Nanoscale Computing and Communication, pp. 1-6. 2020.
M. A. Ehsan, H. An, Z. Zhou, and Y. Yi, “Adaptation of Enhanced TSV Capacitance as Membrane Property in 3D Brain-inspired Computing System,” in Proceedings of the 54th Annual Design Automation Conference (DAC) 2017, p. 86.
H. An, M. S. Al-Mamun, M. K. Orlowski, and Y. Yi, “Learning Accuracy Analysis of Memristor-based Nonlinear Computing Module on Long Short-term Memory,” in Proceedings of the International Conference on Neuromorphic Systems, 2018, p. 5.
H. An, M. A. Ehsan, Z. Zhou, and Y. Yi, “Electrical modeling and analysis of 3D synaptic array using vertical RRAM structure,” 18th International Symposium on Quality Electronic Design (ISQED),2017, pp. 1-6. (Best Paper Nomination)
C. Zhao, J. Li, H. An, and Y. Yi, “Energy-efficient analog spiking temporal encoder with verification and recovery scheme for neuromorphic computing systems,” in Quality Electronic Design (ISQED), 18th International Symposium on, 2017, pp. 138-143.
H. An, Z. Zhou, and Y. Yi, “Memristor-based 3D neuromorphic computing system and its application to associative memory learning,” in IEEE 17th International Conference on Nanotechnology (IEEE-NANO), 2017, pp. 555-560.
H. An, Z. Zhou, and Y. Yi, “Opportunities and challenges on nanoscale 3D neuromorphic computing system,” in Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2017 IEEE International Symposium on, 2017, pp. 416-421.
H. An, Z. Zhou, and Y. Yi, “3D Memristor-based Adjustable Deep Recurrent Neural Network with Programmable Attention Mechanism,” in Proceedings of Neuromorphic Computing Symposium (NCS), 2017.
C. Zhao, J. Li, H. An, and Y. Yi, “When Energy Efficient Spike-Based Temporal Encoding Meets Resistive Crossbar: From Circuit Design to Application,” in Proceedings of Neuromorphic Computing Symposium, 2017.
H. An, M. A. Ehsan, Z. Zhou, and Y. Yi, “Electrical modeling and analysis of 3D Neuromorphic IC with Monolithic Inter-tier Vias,” in Electrical Performance of Electronic Packaging and Systems (EPEPS), 2016 IEEE 25th Conference on, 2016, pp. 87-90.
M. A. Ehsan, H. An, Z. Zhou, and Y. Yi, “Design challenges and methodologies in 3D integration for neuromorphic computing systems,” in Quality Electronic Design (ISQED), 2016 17th International Symposium on, 2016, pp. 24-28.