論文發表

 Nafei, A., Chen, S. C., Garg, H. *, Huang, C. Y. *, Smarandache, F., & Azimi, S. M. (2025 March). Improving industrial automation selection with dynamic exponential distance in neutrosophic group decision-making framework. Journal of the Operational Research Society, 1-20. (SSCI)

Huang, C. Y., Chan, C. C., Weng, C. Y., Nafei, A.*(2025 January). Mitigating solder voids in quad flat no-lead components: A vacuumreflow approach. Microelectronics Reliability, Volume 164, 115564.(SCIE)

 Nafei, A., Azizi, S. P., Edalatpanah, S. A. *, & Huang, C. Y. * (2024 December). Smart TOPSIS: a neural Network-Driven TOPSIS with neutrosophic triplets for green Supplier selection in sustainable manufacturing. Expert Systems with Applications, 255, 124744. (SCIE)

 Huang Chien-Yi *, Chung Ya-Wei (2024 Aug). Management of 3D Printing Processes: Enhancing Pick-and-Place Machine Quality with Taguchi and Principal Component Analysis. Management Analytics and Social Insights, 1(2), 154-170.

Peng, S. N., Huang, C. Y., Liu, H. D.* (2024 July). Hybrid Management Strategy for Outsourcing Electromechanical Maintenance and Selecting Contractors in Taipei MRT. Mathematics, 12(14), 2192(SCIE)

Huang, C. Y.*, Tsai P.X. (2024 March). Applying Machine Learning to Construct a Printed Circuit Board Gold Finger Defect Detection System. Electronics, 13(6),1090.(SCIE) 

黃乾怡，彭松能，劉華棟；(2024 Janu)；‘臺北捷運機電維修外包及外包廠商選擇之順序’；景文書報，第33卷第1期，pp.1-23 

Nafei, A., Huang, C. Y., Javadpour, A., Garg, H.*, Azizi, S. P., & Chen, S. C. (2024 Jan). Neutrosophic Fuzzy Decision-Making Using TOPSIS and Autocratic Methodology for Machine Selection in an Industrial Factory. International Journal of Fuzzy Systems, Volume 26, pages 860–886. (SCIE) 

Nafei, A., Huang, C. Y.*, Azimi, S. M., & Javadpour, A. (2023). An optimized model for neutrosophic multi-choice goal programming. Miskolc Mathematical Notes, 24(2), 915-931. (SCI)

Nafei, A., Huang, C. Y.*, Azizi, S. P., & Chen, S. C. (2023). An optimized method for solving membership-based neutrosophic linear programming problems. Studies in Informatics and Control, 31(4), 45-52.(SCI)

Nafei, A., Huang, C. Y.*, Chen, S. C.*, Huo, K. Z., Lin, Y. C., & Nasseri, H. (2023). Neutrosophic autocratic multi-attribute decision-making strategies for building material supplier selection. Buildings, 13(6), 1373. (SCI)

Azizi, S. P., Huang, C. Y., Chen, T. A.*, Chen, S. C., & Nafei, A. (2023). Bitcoin volatility forecasting: An artificial differential equation neural network. AIMS mathematics, 8(6), 13907-13922. (SCIE)

Ruano, M., Huang, C. Y., Nguyen, P. H.*, Nguyen, L. A. T., Le, H. Q., & Tran, L. C. (2023). Enhancing sustainability in Belize’s ecotourism sector: A fuzzy Delphi and fuzzy DEMATEL Investigation of Key Indicators. Mathematics, 11(13), 2816. (SCIE)

Ruano, M.*, & Huang, C. Y. (2023). A novel approach to service design within the tourism industry: creating a travel package with AHP-TRIZ integration. Systems, 11(4), 178. (SSCI)

Huang, C. Y.*, Lin, I. C., & Liu, Y. L. (2022 Feb). Applying deep learning to Construct a defect detection system for ceramic Substrates. Applied Sciences, 12(5), 2269.(SCI)

Peng, S. N., Huang, C. Y., & Liu, H. D.* (2022). A Novel CSAHP Approach to Assess the Priority of Maintenance Work Outsourced by a Metro Company. Processes, 11(1), 100. (SCI)

Ramirez, R., Huang, C. Y., & Liang, S. H. (2022 August). ‘5G Digital Twin: A Study of Enabling Technologies’, Applied Sciences, 12(15), 7794. (SCI)

Huang, C. Y., Lee, D., Chen, S. C., & Tang, W. (2022 April). ‘A Lean Manufacturing Progress Model and Implementation for SMEs in the Metal Products Industry’, Processes, 10(5), 835. (SCI)

Huang, C. Y*., Lin, I. C., & Liu, Y. L. (2022 February). ‘Applying Deep Learning to Construct a Defect Detection System for Ceramic Substrates’, Applied Sciences, 12(5), 2269. (SCI)

Huang, C. Y., Shen, L. C., Chan, C. J., & Wang, C. H. (2022 January). ‘Applying Taguchi Method to Optimize Vacuum Printing Encapsulation Process’, IEEE Transactions on Components, Packaging and Manufacturing Technology, 12(1), 185-191. (SCI)

Huang, Chien-Yi, et al. ‘Design criteria for pad and stencil with high pick-and-Place yield.’ Soldering & Surface Mount Technology .34.3 (2022): 145-152. (SCI)

Chen, S. C., Lee, D. S., & Huang, C. Y. (2021 November). ‘Evaluating the Sustainable Operating Performance of Electronics Industry Groups: Taiwanese Firms in Mainland China’, Sustainability, 13(21), 12030. (SCI、SSCI、SDG9)

Chen, C. H., Huang, C. Y., & Huang, Y. C. (2021 September). ‘Improving the electromagnetic compatibility of electronic products by using response surface methodology and artificial neural network’, Microelectronics International. (SCI)

Huang, C. Y., Shen, L. C., Greene, C., & Yang, C. C. (2021 July). ‘Parameter Optimization of Pretin Printing Process of Wireless Communication Module’, IEEE Transactions on Components, Packaging and Manufacturing Technology, 11(7), 1137-1147. (SCI)

Ramirez, R., Huang, C. Y., Liao, C. A., Lin, P. T., Lin, H. W., & Liang, S. H. (2021 July). ‘A Practice of BLE RSSI Measurement for Indoor Positioning’, Sensors, 21(15), 5181. (SCI)

Huang, C. Y., Ruano, M., Herrera, M. T. E., & Rodas, R. N. P. (2021 April). ‘A machine learning-based framework for exchange rate analysis and prediction’, A machine learning-based framework for exchange rate analysis and prediction, 74(1), 16-16. 

Huang, C. Y., Shen, L. C., Wu, T. H., & Greene, C. (2020 October). ‘Application of multi-quality parameter design in the optimization of underfilling process–a case study of a vehicle electronic module’,  Soldering & Surface Mount Technology, Vol.33, Issue 2, pp.128-138 (SCI)

Huang, C. Y, & Wang, P.J. (2020). ‘Failed Component Image Acquisition Quality Optimization For Machine Vision System’, Journal of Current Trends in Signal Processing, Vol.10, Issue 2, pp.17-25. 

Inkaew, A., & Huang, C. Y. (2019). ‘Exploring consumer behavior of Thai millennials towards buying consumer electronics online’ , RMUTT Global Business Accounting and Finance Review, 3(3). 

Huang, C. Y., Ruano, M., Chen, C. H., & Greene, C. (2019 September). ‘Applying data mining methodology to establish an intelligent decision system for PCBA process’, Soldering & Surface Mount Technology. (SCI)

Huang, C. Y., Hong, J. H., & Huang, E. (2019 September). ‘Developing a machine vision inspection system for electronics failure analysis’, IEEE Transactions on Components, Packaging and Manufacturing Technology, 9(9), 1912-1925. (SCI)

Huang, C. Y., Wu, J. Y., & Huang, E. (2019 June). ‘A digital image processing model for characteristics capture and analysis of irregular electronic components’, The International Journal of Advanced Manufacturing Technology, 102(9), 4309-4318. (SCI)

Huang, C. Y., & Ying, K. C. (2019 June). ‘Intelligent parametric design for a multiple-quality-characteristic glue-dispensing process’, Journal of Intelligent Manufacturing, 30(5), 2291-2305. (SCI、SDG9)

Huang, C. Y., Chen, C. H., & Greene, C. (2019 January). ‘Using parametric design to reduce the EMI of electronics products-example of medical-grade touch panel computer’, Progress In Electromagnetics Research C, 89, 13-26. (SCI、SDG9)

Huang, C. Y. (2018 May). ‘Applying the Taguchi parametric design to optimize the solder paste printing process and the quality loss function to define the specifications’, Soldering & Surface Mount Technology, 30(4), 217-226. (SCI)

Lin, S. W., Huang, C. Y., Ying, K. C., & Chen, D. L. (2018 March). ‘Decreasing the system testing makespan in a computer manufacturing company’, IEEE Access, 6, 16464-16473. (SCI、SDG9)

Huang, C. Y. (2018 February). ‘Applying multivariate analysis to analyze and improve component rejection by pick and place machines’, The International Journal of Advanced Manufacturing Technology, 96(1), 1265-1281. (SCI)

Huang, C. Y., & Ying, K. C. (2017 November). ‘Applying strain gauges to measuring thermal warpage of printed circuit boards’, Measurement, 110, 239-248. (SCI)

Huang, C. Y. (2017 August). ‘ Applying Monte Carlo simulation to analyze the open scenario in the assembly of electronic components’, IEEE Transactions on Components, Packaging and Manufacturing Technology, 7(11), 1911-1919. (SCI)

Chen, C. H., & Huang, C. Y. (2017 May). ‘Improve electromagnetic interference of electronic products with Taguchi parametric design’, Measurement, 102, 200-207. (SCI)

Huang, C. Y., & Chen, C. H. (2017 January). ‘Improve electromagnetic compatibility of electronic products with multivariate parametric design’, Microelectronics International. (SCI)

Huang, C. Y., & Ying, K. C. (2016 October). ‘Dynamic parametric design and feasibility assessment for a high resistance measuring system’, Measurement, 92, 42-49. (SCI)

Huang, C. Y., Chen, C. H., & Lin, Y. H. (2016 February). ‘ A grey-ANN approach for optimizing the QFN component assembly process for smart phone application’, Soldering & Surface Mount Technology, 28(2), 63-73. (SCI)

Huang, C. Y., Jan, T. J., & Wu, C. C. (2015 February). ‘Applying TRIZ Methodology to Develop the Probe Card Tester in Semiconductor Manufacturing’, International Journal of Systematic Innovation, 3(3).

Chen, C. H., & Huang, C. Y. (2015 June). ‘The synergy of QFD and TRIZ for solving EMC problems in electrical products–a case study for the notebook PC’, Journal of Industrial and Production Engineering, 32(5), 311-330. (EI)

Huang, C. Y., Lin, Y. H., & Tsai, P. F. (2015 March). ‘Developing a rework process for underfilled electronics components via integration of TRIZ and cluster analysis’, IEEE Transactions on Components, Packaging and Manufacturing Technology, 5(3), 422-438. (SCI) 

Chang, M. T., & Huang, C. Y. (2015 February). ‘An innovative bamboo film inspired by workout and Triz’, Journal of Industrial and Production Engineering, 31(8), 513-523. (EI)

Huang, C. Y. (2015 February). ‘Innovative parametric design for environmentally conscious adhesive dispensing process’, Journal of intelligent manufacturing, 26(1), 1-12. (SCI)

HUANG, J. C. Y., & Abrego, R. B. (2014). ‘Systematic Innovation for the Retention and Development of Human Talent’, International Journal of Systematic Innovation, 3(2).

Chang, M. T., & Huang, C. Y. (2014 October). ‘A study on introducing supplier process capacity database into tolerance design’, Journal of Industrial and Production Engineering, 31(7), 379-404. (EI)

Huang, C. Y., Palacios, C., Hong, Z. S., & Chen, C. H. (2014 August). ‘Parametric Design of the Adhesive Dispensing Process with Multiple Quality Characteristics’, 品質學報, 21(4), 233-245. (EI)

Huang, C. Y., & Huang, H. H. (2014 July). ‘ Process optimization of SnCuNi soldering material using artificial parametric design’, Journal of Intelligent Manufacturing, 25(4), 813-823. (SCI) 

Huang, C. Y., Lin, Y. H., & Huang, E. (2014 January). ‘DOM Products: Activation Energy Estimation and Reliability Assessment’, In Applied Mechanics and Materials (Vol. 470, pp. 781-784). Trans Tech Publications Ltd. (EI)