Embedded Files
Deadline for paper submission: April 15, 2025
Deadline for acceptance: June 15, 2025
Deadline for camera ready: July 1, 2025
The VDAT 2025 conference provides a platform for researchers and practitioners to explore how VLSI and Embedded Systems can drive disruptive advancements for the next generation. Original contributions are solicited on topics covered under broad areas such as (but not limited to) below mentioned topics.
Paper Submission: Authors are invited to submit full-length (6 pages maximum), original, unpublished papers along with an abstract of at most 200 words. To enable blind review, the author list should be omitted from the main document. Previously published papers or papers currently under review for other conferences/journals should NOT be submitted and will not be considered. Electronic submission in PDF format is required. Author and contact information (name, affiliation, mailing address, telephone, fax, e-mail) must be entered during the submission process. Paper Format: Submissions should be in camera-ready IEEE two-column format, following the IEEE proceedings specifications.
Topics of Interest
Conference has four tracks
Track 1 Emerging Materials and Devices Technologies:
Emerging materials
2-D Material
High-voltage MOSFET
Si photonics and optoelectronics
Spintronics and quantum materials
MEMS/NEMS
Organic electronics
Emerging memory technologies
Track 2: VLSI Circuit and SoC Design
Digital, Analog, Mixed signal, RF) circuits,
RTL design,
Processor Architecture,
Hardware accelerators
FPGA based design
Quantum
Neuromormorphic
Memory
Track 3: Electronics Design Automation, Testing and Verification
CAD Tools, software
CAD for FPGA
High Level Synthesis
System software
Testing and Verification
Packaging (Signal and Power Integrity)
Track 4: Embedded Systems Design
Hardware/Software co-design and verification
Audio, Image and Video processing on embedded systems
Reconfigurable systems
Micro-controller, IoT and FPGA-based Embedded systems design
Embedded software
Embedded systems design, real time systems
Track 5: Manufacturing and Packaging
Manufacturing
Packaging
Signal and Power Integrity
Submission Instructions
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