Teaching

MM505 :: Electron Microscopy and Microanalysis :: 3-0-0-6.00-3.00 || Module - 8; Classes - 42||  Winter semester

Introduction and Basics of Scanning electron microscope (SEM); Imaging and Contrast Formation in SEM; Specialized SEM techniques and microchemical analysis; Microchemical Analysis - EDS and WDS; EBSD and Application to Materials Characterization; tKED, Introduction of Transmission Electron Microscope (TEM) and operating modes; Diffraction Basics in TEM; Diffraction and Imaging; HRTEM, Defects Imaging; Precession electron diffraction (PED)

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MM501:: Advanced Materials Characterization Techniques:: 3-0-2-7-4|| Module - 1; Classes - 10 || 

Module : End :: EBSD and Application to Materials Characterization

1. Part – 1: Basic of EBSD and Structure Identification: Crystallographic planes and directions, Electron Diffraction in SEM, Formation of Kikuchi Pattern, Design of EBSD Detector and working principle, Indexing of the Kikuchi Patterns, Automated System for Indexing the Kikuchi.

2. Part – 2: EBSD data acquisition and analysis: Introduction to EBSD data analysis software; Grain Size and Grain Boundary Misorientation Calculations; Strain and Geometrically Necessary Dislocation Measurements; Twining, Recovery and Recrystallization Prediction.

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MM 504: Deformation Fracture and Damage of materials:: 3-1-0|| Module - 6; Classes - 42|| Winter semester

1. Basic concepts of elasticity theory and stress-strain relations; Basic concepts of plasticity theory and stress-strain relations; Plastic deformation in metallic materials: slipping, twinning, dislocations; Lomer. Lomer-Cottrell barrier, Sources of Dislocations; Forces on and between dislocations; stacking fault, Thompson Tetrahedron for FCC partial dislocation and strengthening related to dislocations; Plastic deformation in material: Yield criteria, Yield function, Hill’s plasticity, anisotropic plasticity, Isotropic, kinematic and coupled plasticity; Numerical implementation/algorithms of plastic behaviour: Deformation and Incremental plasticity; Other Yield functions: Gurson’s Yielding.

2. Fatigue of Materials: S-N Curve, strain controlled Fatigue, stress controlled fatigue, VHCF: a true limit to fatigue strength, Quantitative fractography of fatigue, Fatigue crack growth testing, Paris Law.

3. Creep: Regions and mechanisms of creep, Nabarro, Harper Dorn, Coble creep, creep zones in presence of a crack, C*, Ct integrals for creep crack, Ct-avg for creep fatigue crack. Creep fatigue deformation, Superplasticity.

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