Session 2- Overview of Semiconductor Technology
7/28-8/3, 2024 

Offered by PICD: Program on Integrated Circuit Design

IC design overview is to introduce the fundamentals of IC design to those interested in this field. It starts from basic binary logic blocks followed by arithmetic modules. Modules are organized in a logical way to perform computation. Then how to transform and realize a design into an integrated circuit by hardware description language and state-of-the-art design tools. In the end, how one can validate and confirm the success of the design. A concise yet insightful view can help learners quickly grasp the essences of IC design. It would be highly useful to people who want to have a jump start and know how we train students in Taiwan.

Lecture 1: Essences of Computer Organization
Lecture 2: Binary Logic & Arithmetic Modules 

Lecture 3: Transform Design using HDL & EDA Tools

Lecture 4: Smart sensing heterogeneous integration chip technology: TSRI- Heterogeneous Chip Integration Lab 

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Offered by PSMT: Program on Semiconductor Manufacturing Technology

Semiconductor-based nanophotonics and their applications

The short course provides an introduction to nanophotonics based on semiconductors and their device applications. Types of optical resonators, including photonic crystals, antennas, and bound states in the continuum will be introduced.  Applications of nanophotonic resonators to nanospectroscopy and cavity quantum electrodynamics (CQED) will also be discussed.

Semiconductor Fabrication

Semiconductor Fabrication delves into the heart of the microelectronics industry, focusing on the manufacturing process of semiconductor devices. This course offers students an essential understanding of the steps involved in the fabrication of semiconductors, including material preparation, chemical/physical vapor deposition, photolithography, etching, and ion implantation. Students will gain insight into the sophisticated processes and innovations that enable the production of ever-smaller and more powerful semiconductor devices. 

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Offered by PSPT: Program on Semiconductor Packaging and Testing

Innovative 3DHI (3D Hetegeneous Integration) Packaging Technology Development 

3D Heterogeneous Integration (3DHI) has been widely used as one of the effective enablers for “More-than-Moore” technology since the advanced wafer node scaling down relying on front-end technology is getting hard to achieve the goal of business return. 

With traditional transistor pitch scaling facing fundamental challenges, 3D Heterogenous Integration Packaging technologies adopting Through Si Via (TSV) and Hybrid Bonding are poised to help enabling the future AI / HPC device applications.

In this class, to help the students to realize the advantages of 3D Heterogeneous Integration (3DHI), market trend, technology benchmark, process challenges and its effective solutions for the following topics will be specifically addressed.

Topic Coverage:

1.3DHI Market Trend and Product Applications, focusing on AI / HPC

2.3DHI Technology for CPO (Co Package Optics)

3.3DHI Technology for COWOS(TSV/BVR) / Hybrid Bonding (C2W / W2W)

4.3DHI Technology for Advanced Substrate

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This course will introduce the basic principle of the fabrication of nanomaterials and nanocomposites. The unique properties of nanomaterials strongly depend on their morphology and composition, leading to specialized applications, such as sensing, optical and electronic devices. Therefore, the fabrication process of nanomaterials plays an important role in manipulating material properties. The properties of nanocomposites can be influenced by the intrinsic properties of individual materials and extrinsic properties of syngenetic effects between materials, which make it possible to engineer the desired properties of nanocomposites. This course also focuses on designing the special functions of nanomaterials and nanocomposites for desirable applications.

Offered by KMAT: Program on Key Materials

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Offered by PSSM: Program on Smart and Sustainable Manufacturing

The concept of circular economy has gained significant attention in recent years, with various industries adopting different systems to tackle issues. In Taiwan, the electronics industry is a key contributor to the economy, but it also generates a significant amount of waste, pollution, and some problems. Therefore, there is a pressing need to improve the sustainability of this sector. This class aims to introduce some systems and recycling technologies (silicon resources) which can help Taiwan achieve the goals of the circular economy and address these challenges.

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※The above information is subject to change.