“Electronic device switches on and off heat at top speed with precision”, Electronic Product & Technology, January 18, 2024. [link]
“Scientists Finally Invent Heat-Controlling Circuitry That Keeps Electronics Cool”, Scientific American, January 3, 2024. [link]
“The Top 10 Semiconductor Stories of 2023”, IEEE Spectrum, December 26, 2023. [link]
“Thermal transistor could cool down computer chips”, Physics World, December 19, 2023. [link]
“Thermal Transistors Handle Heat With No Moving Parts”, IEEE Spectrum, November 13, 2023. [link]
“Solid-state ‘thermal transistor’ controls heat flow with ±2.5V”, Electronics Weekly, November 10, 2023. [link]
“Researchers develop solid-state thermal transistor for better heat management”, Tech Xplore, November 2, 2023. [link]
“Strange Material Breaks a Classic Rule of Physics”, Scientific American, April 1, 2023. [link]
“Discovery contradicts physics principle that heat always moves faster as pressure increases”, highlighted by National Science Foundation, February 7, 2023. [link]
“Under Pressure, Heat Doesn’t Always Move Faster”, highlighted by Advanced Cyberinfrastructure Coordination Ecosystem: Services & Support, February 21, 2023. [link]
“Research unearths obscure heat transfer behaviors”, Science Daily, December 28, 2022. [link]
“This semiconductor breaks the rules of physics under pressure”, Chemical and Engineering News, December 14, 2022. [link]
“Research unearths obscure heat transfer behaviors”, highlighted by Argonne National Lab, December 5, 2022. [link]
“Heat transfer succumbs to pressure in boron arsenide”, Materials Today, December 5, 2022. [link]
“UCLA-led research unearths obscure heat transfer behaviors”, EurekAlert, November 28, 2022. [link]
“Heat-Management Material Keeps Computers Running Cool”, Tech Briefs, June 1, 2022. [link]
“Better heat dissipation points to improved electronics”, highlighted by Pittsburgh Supercomputing Center, November 17, 2021. [link]
“To handle the heat, researchers add boron arsenide to high-power computer chips”, Tech Briefs, October 1, 2021. [link]
“New semiconductor cools computer chips”, Physics World, August 5, 2021. [link]
“Boron arsenide thermal management”, Semiconductor Today, July 2, 2021. [link]
“Boron arsenide spreads heat better than diamond”, Electronics Weekly, June 30, 2021. [link]
“Novel heat-management material keeps computers running cool”, Science Daily, June 29, 2021. [link]
“Efficient semiconductor materials for thermal management”, Tech Briefs, October 1, 2018. [link]
“UCLA develops defect-free boron arsenide as most efficient semiconductor material for thermal management”, Semiconductor Today, July 20, 2018. [link]
“Boron arsenide boosts high thermal conductivity”, Chemical and Engineering News, July 17, 2018. [link]
“Boron arsenide thermal record – the second in a week”, Electronics Weekly, July 10, 2018. [link]
"Pursue excellence, make the world a better place - A Profile of 2012 Undergraduate Huan Wu", highlighted by School of Energy Science and Engineering, Harbin Institute of Technology, August 9, 2016. [link]