Reports

Final Report:

Final Report

Executive Summary:

 Executive Summary - Group 18 

Individual Component Analysis Reports:

Each person in the group was assigned to a different essential component in the design to perform in-depth research in that subject. This research included anything from how a specific component works to talking to companies about what they had to offer that would fit within our specifications. Links to each individual analysis is down below.

Heat Sinks and Cooling - Alex Fernandez

One of the specifications our sponsors gave us was to include a cooling system like the one that they currently have inside their thermal control unit, which is a fan cooler over a heat sink. Various types of heat sinks were found that could be implemented into the design with descriptions and data sheets. Pros and Cons for each of the products were listed down. Because the heat sink size is reliant mainly on the chassis and the portion of the thermal unit it will be mounted on, choosing a specific product will be done later in the process. However, with this being said, there are a range of companies to order from and a range of effective heat sinks that fit within any of our required specs 

Circuit Breakers - Diego Flynn

Heating Elements - Amir Saman Naseri

Temperature Sensors - Giordano Liska

Due to the geometrical constraint of the TCU, a small package temperature sensor able to read up to 200C was required. Through analysis of different types of temperature sensors, the RTD was chosen due to its accuracy, geometry, and ease of use/interchangeability.