1.High speed silicon-based integrated optoelectronic circuit for short-wave infrared detection (矽基短波紅外光高速偵測器積體電路):
近年來,由於網路的盛行,人類對於資料的交換、環境的識別與隱私權的需求爆炸性增加,使得紅外光感測元件的需求大幅增加。其中,光通訊元件、用於自動車輛三維環境建構的光達系統與用於隱私權人臉辨識,在效能與安全的考量下,將轉向1550 nm。但1550 nm 的光偵測器根基於Ge與InGaAs,基板與製程的成本相當高,以至於大量應用受到限制。本研究面對此一問題,提出以矽為基板,搭配奈米結構與新穎高折射率差二氧化矽-鍺錫週期性結構矽光子紅外偵測器技術。
起始研究工作將著重在元件製程的開發,與探討週期孔洞對多晶鍺錫吸光特性的關聯性。光波範圍將以1000-1600 nm分光光源為主。以光吸光能力來做為評估元件好壞的機制,同時進行實驗室等級光偵測器元件的製作,並與國際結果進行比較,達成在1550 nm外部量子效率大於 20 %,光響應大於 0.30 A/W。基於多晶鍺錫於紅外光吸收最佳化的研究成果,提升光偵測器元件的效能,並將著重於將多晶鍺錫光偵測器技術導入矽積體電路中,以積體電路公司的製程製作電晶體、反相器、電阻、電感、電容等元件,並以BiCMOS 技術製作接觸區,同時保留紅外光光偵測器區域。研究後製程對於轉阻放大器元件特性的影響。本年度將同時研究鍺錫紅外光偵測器的的動態行為,了解電荷產生、電荷轉移,與電荷消失的機制,尋找光電反應時間的主要因素,達成在1550 nm外部量子效率大於 40 %,光響應大於 0.50 A/W,元件頻寬大於25 GHz。最終研究將著重在達成高速矽積體電路化鍺錫高效能電紅外光偵測器電路,目標是10Gb/s 的光電積體電路。第二年研究將建立鍺錫紅外光偵測器製程對積體電路元件特醒的影響參數,將持續進行後製程溫度修正,以確保積體電路元件正常。最後,將利用所得到的參數,以現有的轉阻放大器電路與高折射率差週期性鍺錫結構紅外光偵測器整合成為短波紅外光高速光偵測器電路。藉由此一研究的完成,將加速矽光子紅外光偵測器的廣泛應用。
In recent years, due to the fast growing of of the world-wide web, the demanding on data exchange, 3D environment re-construction and smart phone security, which has greatly increased the demand for infrared photodetectors. Among these applications, the optical wavelength for component/subsystems such as fiber transceiver module, lidar for the automatic vehicle and face recognition for security, will migrate to 1550 nm under the consideration of performance and safety. However, the 1550 nm photodetector is based on Ge and InGaAs, in which the cost of the substrate and device process is too high to be ubiquitous. In this proposal, we propose a 1550 nm infrared photodetector comprise Si as the substrate and nanostructures for light-trapping and a novel, high refractive index contrast SiO2-GeSn materials for light absorption.
We will focus on the development of the device process for the infrared photodiode and explore the correlation between the periodic microholes and the light absorption characteristics of silicon dioxide/germanium-tin high refractive contrast periodic structure. The light source will be based on the 1000-1600 nm monochromatized light source. The light absorption capacity was used as the key parameter to evaluate the quality of the microhole array. At the same time, the photodetector was made and bench marked with international results. The external quantum efficiency was aim to larger than 20% at 1550 nm, and the responsivity higher than 0.30 A/W was expected. Based on the research results of the optimization of infrared absorption of Silicon dioxide/germanium-tin periodic structure in the first year, the performance of photodetector will be improved. The external quantum efficiency was aim to larger than 40% at 1550 nm, and the responsivity higher than 0.50 A/W, bandwidth larger than 25 GHz was expected. In addition, we will integrate Silicon dioxide/germanium-tin periodic photodetector into 0.18 um BiCMOS technology. MOSFETs, inverters, resistors, inductors, capacitors and other components that used in the transimpedance amplifier were designed and evaluated in the BiCMOS technology. Meanwhile, leave an area for infrared light detector in this design. The final goal of this research will focus on the realization of high-speed silicon integrated circuit-based on germanium-tin high-efficiency electrical infrared photodetector circuits with a target of 10 Gb/s.With this technology, we believe the integrated photonic circuit for 1550 nm will be realize for variety of application, especially the LiDAR in self-driving cars.