Real Time Deembedding for Everything Including USB 3.0

Abstract: Every signal including USB 3.0 has to travel down a channel, but sometimes you would like to remove the effects of this channel. Whether it’s a probe, cable or board, the channel will shrink your signal. You can use deembedding to remove these losses, and get your signal back. Using Real time deembedding from Rohde and Schwarz, you can keep your scope running ultra-fast while you analyze your real signal.

Real Time Spectral Analysis with Hardware Demos

Abstract: Troubleshooting and localizing intermittent signals or multiple layers of broadband and narrowband signals can be frustrating even for the most seasoned EMC troubleshooter or RF engineer. In this presentation, Lee will discuss the capabilities of different types of spectral analysis technologies, and then demonstrate how real-time analysis can literally make previously hidden signals leap into plain view. This session will include live, real-time measurements of intermittent, broadband, and narrowband sources such as switching power supplies, digital peripherals, Bluetooth and class D audio amplifiers. Even If you have already heard or read about real-time spectral analysis, this is a great chance to see in person why engineers say out loud, “wow, did you see that?” when watching it for the first time.

Signal & Power Integrity, EMI/EMC for PCB Design

Abstract: In this workshop, the typical Power and Signal integrity EMI/EMC issues on PCBs will be solved by a Full wave hybrid simulation approach coupled with the help of an advanced circuit simulator for the non-linear time transient analysis. The PCB scattering parameter extraction provided by our full wave hybrid numerical code helps to identify issues on Power Delivery Network (PDN) and run a design of experiment genetic algorithm which can find the right decoupling capacitor strategy based on PDN noise and capacitor number minimization. Examples of this technique will be presented in this workshop. The circuit simulator, with the PCB scattering parameter to steady-state space model conversion though advanced mathematical models, is used to build a full non-linear transient simulation to evaluate eye diagrams, voltage/currents transient diagrams and all the quantities useful for solving Signal Integrity issues, importing IBIS and Spice models for active devices in our environment. The time domain currents can be transformed in the frequency domain by a Fast Fourier Transform (FFT) and these can be analysed as a direct output for conductive emission problems, connecting circuit models for the Linear Impedance Stabilization Network (LISN). Examples of signal integrity and EMI/EMC will be presented in real cases. The PCB and Circuit coupling are even important for evaluating the EMI/EMC issues. The Steady-state model is dynamically linked with the PCB project and the time domain current can be pushed back to the PCB as FFT to calculate the Near and Far-field by integrating the currents on the PCB. This helps designers to predict EMI/EMC issues and discover critical areas on the PCB. Moreover, a novel Multiphysics approach has been developed to consider DC-Bias and temperature for the PCB capacitors. A DC solver can be used to evaluate the DC current and voltage distribution on the PCB and discover if there are traces or bias with a high current density, and at the same time, to evaluate the DC-Bias condition. The capacitor models have a DC-Bias and temperature dependence which can be automatically read by our internal code and the PCB can be simulated in the operative conditions which can have a significant impact on the EMI/EMC results in some cases. Examples of this new technique and the Multiphysics approach will be shown in the workshop.

Agenda:

· Introduction to Electromagnetic simulation for PCB design

· DC and thermal multiphysics simulation for PCB · Power Integrity Analysis and decoupling capacitor strategy and optimization

· Signal Integrity, Eye Diagrams, TDR and Z0 impedance scan

· EMI/EMC near and far field analysis