[ IEEE EPEPS 2021 ]

Copper Pour: Measurement and Simulation Correlation

A paper focused on measurement and simulation correlation of a coupled microstrip structure, and the impact copper pour has on it, its importance in validating a model in any Electronic Design Automation (EDA).  Showing the power of simple inductor and capacitor elements along with pre-existing coupled transmission line models in Keysight's Pathwave Advanced Design Systems (ADS) in modelling relatively complex phenomenon.


The paper was presented at the Electronic Performance and Electrical Packaging Conference on October 20th, 2021 and is available in IEEE explore. The presentation can be found here.

Fig. Showing an example of a board with and without the copper pour.