Major Research Thrusts

Metamaterials for Cryogenic Packaging:

Scaling the Quantum Computing Frontiers 

Scaling quantum processors to the thousand-qubit regime requires high-density integration of RF control and readout electronics (DACs, mixers, LNAs) at the cryogenic stage. Traditional planar packaging fails this transition due to a fundamental thermal-electromagnetic bottleneck. 

Our Innovation: Metastructure Interposers

To solve this, our lab has developed a Metastructure-Based Interposer. By re-engineering both the physical morphology and the electromagnetic properties of the interconnects, our 3D packaging architecture provides:

• Zero Crosstalk: Morphologically dissimilar traces eliminate field coupling, allowing for ultra-dense signal routing.

• Inherent Noise Filtering: Built-in EM bandgaps natively block broadband interference before it reaches the quantum stage.

• Enhanced Thermal Management: High surface-to-volume geometries rapidly dissipate localized Joule heating from active RF components.

Etching Neuroplasticity in Silicon

Re-imagining Hardwares for Sustainable AI

Today’s AI forces biological, pattern-driven software onto rigid, mathematical hardware. This brute-force emulation is so inefficient that AI data centers could consume up to 25% of the U.S. power grid by 2030. We cannot scale AI without fundamentally changing the hardware.

Our Innovation: A Hardware Brain Instead of forcing silicon to act biological, we physically etch brain-like behavior into the chip. We have developed a VO2-based thermal waveguide that mimics human neuroplasticity by actively recycling the processor's own waste heat.

How It Learns and Forgets:

• It Learns: When the processor works hard and heats up past 69 degree celcius, the VO2 automatically becomes conductive, strengthening the signal.

• It Forgets: When the chip cools, the connection naturally weakens.

The Impact By creating hardware pathways that naturally strengthen and fade like real neural synapses, we eliminate the massive energy waste of traditional computing. We are building machines that physically function like biological brains.

Fault Tolerant Interconnect Design with no power or performance compromise

Bypass faulty wires Electromagnetically

In high-density chips, intermittent failures of interconnects are a highly problematic issue. But dedicating permanent, redundant backup wires to fix transient failures is a massive waste of valuable real estate.

Our Invention: Piggybacking on unutilized spectrum. We invented a new idea of 'Spectral Harvesting' to bypass the faulty path. It dynamically rescues data without needing dedicated physical backups. When a micro-solder joint fails, we shift the affected data to a higher carrier frequency.

Driven by a novel, entirely passive electromagnetic coupler, this high-frequency data naturally crosses over and piggybacks onto an adjacent healthy wire. The healthy wire concurrently carries both signals—perfectly isolated by frequency. At the destination, a mirror coupler extracts the rescued data to its correct pin.

Here is an Interactive Demonstration of the proposed concept: