Welcome to my academic website. I am an Assistant Professor at UNC Charlotte, where my research bridges the gap between microwave devices, interconnects and packaging, and semiconductor device reliability. Before joining academia, I spent four years at Intel Corporation as a Device Reliability Research Engineer in the Transistor Pathfinding division.
My lab currently focuses on the following areas:
RF/Microwave Interconnects: Developing electromagnetic interconnects, utilizing artificial plasmonics for advanced packaging used in high-performance Data Centers and cryogenic applications.
Reconfigurable Interconnects by Heat Harvesting: Developing specialized interconnects utilizing phase-change materials that can self-reconfigure their capacity to fit the dynamic workloads of data centers.
Thermally Insulative Electrical Interconnects: Developing system-level interconnects for cryogenic refrigerators that can transmit electronic signals while preventing thermal leakage. These special interconnects have high potential for developing ultra-sensitive quantum systems.
Semiconductor Device Reliability: Investigating the physics of failure (BTI, HCI, TDDB) and developing testing algorithms for high-bandgap devices, specifically GaN HEMTs.
HighLights
Book Publication: Co-author of "Artificial Plasmonics for VLSI Interconnects: Bridging the Gap between Electronics and Optics" (Wiley-IEEE Press, 2025).
Current Funding: Principal Investigator for a 2025-2026 UNCC Faculty Research Grant on reconfigurable interconnects.
Background: Ph.D. in Electrical Engineering from the University of Michigan, Ann Arbor (2020)