Overview of Status of Analysis, Design, Fabrication, Tests, etc.
Need to design with sponsor the final metal mesh model
Need to test out thermal analysis at their facilities with their thermal sensors
Accomplishments from Previous Week
Things completed
Tested hole sizes and the influence on dB levels
Completed fan tests for dB levels based on location and chassis panel
Eliminated possibility of having padding or rubber grommets
Did some rough testing for actual CFM levels of fans
Design ideas 1 and 2 not feasible
Goals for Next Week (list names after each item). Use specific and measurable objectives.
Things to be completed
More thermal analysis for out-of-the-box situations
Calculating backflow for CFM testing
Sponsor Comments from Last Meeting and Actions Taken to Address these Comments
Testing out of 92mm fans
Went ahead and did the testing under the same conditions
Meet up with sponsor to work on final design
Sponsor wanted us to learn how he goes about designing on SW
Instructor Comments from Last Meeting and Actions Taken to Address these Comments
Do thermal stress analysis assuming worst possible conditions
Taken extreme case for PCI-E (75W) and mobo (30W)
PSU will never be stressed at 850W
Calculated that our two most m3/h fans will handle the air flow required
Risks and Areas of Concern
HDD and SSD allocation
Better method to test out flow rate
Our tests run into the issue of backflow
More thermal analysis in depth
Lack of expertise
Schedule
Designing of chassis with sponsor at his convenience
Ordering of chassis designed with sponsor