List of Publications

A full list is available at my Google Scholar Profile

Book Chapter

1. Chen C-f., Rasley, BT, Warlick BPE, Green TK, Swearingen KE, Drew KL, "Microdialysis and advances for sampling synaptic and extrasynaptic pools," in Microdialysis Techniques in Neuroscience, Neuromethods. vol. 75., GD Giovanni and VD Matteo (Eds.), Springer, pp. 63-88, 2013. 

2. C.-f. Chen and J. Lee, “Heterogeneous-medium transport and propagation,” in Encyclopedia of Nanoscience and Nanotechnology, H.S. Nalwa, Ed., American Scientific Publishers, vol 15, pp. 113-145, 2011. 

Refereed Journal Papers (students names underlined) 

1. J. John IV, C.-f. Chen, The Role of APTES as a Primer for Polystyrene Coated AA2024-T3, Micromachines, 15(1), 93; https://doi.org/10.3390/mi15010093.

2. C.-f. Chen, “Polystyrene Coating on APTES-Primed Hydroxylated AA2024-T3: Characterization and Failure Mechanism of Corrosion,” Solids, 4(3), 254-267, 2023. doi.org/10.3390/solids4030016. https://www.mdpi.com/2673-6497/4/3/16.

3. C.-f. Chen and B. Baart, Junqing Zhang, and Lei Zhang, “Polystyrene/TiO2 Nanocomposite Coating for Strength and Toughness Enhancement of Aluminum Alloy 2024-T3 in Accelerated Stress Corrosion Cracking,” Progress in Organic Coatings, 161, 106458, 2021. https://doi.org/10.1016/j.porgcoat.2021.106458,  

4. B. Baart and C.-f. Chen, “Fracture Mechanics Approach to Evaluate Polystyrene/TiO2 Nanocomposite Coating on SCC Susceptibility of Thin-Sheet Aluminum Alloy 2024-Tf3 with 3.4% NaCl,” in preparation, 2021.

5. C.-f. Chen, “Fluorescence Detection of Fluorescein and SYBR Green-Stained DNA by Reflective Cavity-Coupled Fluorometer – A Quantitative Study,” Measurement Journal, 107946, 2020. 10.1016/j.measurement.2020.107946

6. C.-f. Chen, J. Halford IV, and D. Harmon, “A Sensitive Portable Fluorometer Coupled with Miniaturized Integrating Sphere,” Measurement Science and Technology, 31(1), 015204 (8 pp), 2019. (1.861) https://dx.doi.org/10.1088/1361-6501/ab33d3

7. C.-f. Chen, “Dimensional Analysis and Constitutive Equations of Quantitative Microdialysis,” The Scientific Pages of Biomedical Res, 1(1):5-11, 2018.

8. C.-f. Chen, “Characterization of Fracture Energy and Toughness of Air Plasma PDMS-PDMS Bonding by T-Peel Testing,” J. Adhesion Science and Technology,” J. Adhesion Science and Technology, 32(11), pp.1239-1252, 2017.  DOI: 10.1080/01694243.2017.1406877 

9. C.-f. Chen and K. Whartons, “Characterization and Failure Modes Analyses of Air Plasma Oxidized PDMS-PDMS Bonding by Peel Testing,” RSC Advances, 2017, 7, pp. 1286-1289, DOI: 10.1039/c6ra25947b.

10. B. Wilke, L. Zhang, W. Li, C. Ning, C.-f. Chen, Y. Gu, “Corrosion Performance of MAO Coatings on AZ31 Mg Alloy in Simulated Body Fluid vs. Earle's Balance Salt Solution,” Applied Surface Science, DOI: 10.1016/j.apsusc.2015.12.026, 363(15), pp. 328–337, 2016.

11. C.-f. Chen and Z. Quan, “Comment on ’A Compact Analytic Model of the Strain Field Induced by Through Silicon Vias’“, IEEE Transactions on Electron Devices, 62(9), pp 3104-3105, 2015, 10.1109/TED.2015.2463256.

12. C.-f. Chen and S.-T. Wu, “Equivalent Mechanical Properties of Through-Silicon-Via Interposers - A Unit Model Approach,” Microelectronics Reliability, 55, pp.221-230, 2015. DOI: 10.1016/j.microrel. 2014.09.005.

13. J. Zhang, L. Zhang, C.-f. Chen, Y. Gu, “Advances in Microarc Oxidation Coated AZ31 Mg Alloys for Biomedical Applications”, Corrosion Science, 91, pp. 7-28, 2015.

14. C.-f. Chen and T. L. Gerlach, "Rapid prototyping of microfluidic modules with water-developable dry-film photoresist bondable to PDMS," RSC Advances, 2013, 3 (33), pp. 14066-14072, D01:10.1039/C3RA41576G.

15. C.-f. Chen, “Batch Process and Sensitivity Analysis of Collision Detection of Planar Convex Polygons in Motion,” ASME Journal of Computing and Information Science in Engineering, Vol. 13(4), 041001 (8 pp), 2013.

16. Gu,Y., Bandopadhyay, S., Chen, C.-f., Guo, Y., Ning, C., "Long-term corrosion inhibition mechanism of microarc oxidation coated AZ31 Mg alloys for biomedical applications,” Materials and Design, Vol. 46, pp. 66-75, 2013.  doi: 10.1016/j.matdes.2012.09.056

17. L. Chen, J.H. Lee, and C.-f. Chen, “On the modeling of surface tension and its applications by the Generalized Interpolation Material Point Method,” CMES: Computer Modeling in Engineering & Sciences, Vol. 86, No. 3, pp. 199-224, 2012.  doi:10.3970/cmes.2012.086.199

18. Gu,Y., Bandopadhyay, S., Chen, C.-f., Guo, Y., Ning, C., “Effect of oxidation time on the corrosion behavior of micro-arc oxidation produced AZ31 magnesium alloys in simulated body fluid,” J. Alloys and Compounds, 543, 109-117, 2012.  doi:10.1016/j.jallcom.2012.07.130

19. Y. Gu, C.-f. Chen, S. Bandopadhyay, C. Ning, and Y. Guo, “Corrosion mechanism and model of pulsed DC microarc oxidation treated AZ31 alloy in simulated body fluid,” Applied Surface Science, 258(16), pp. 6116-6126, 2012.  DOI 10.1016/j.apsusc.2012.03.016

20. Y. Gu, C.-f. Chen, S. Bandopadhyay, C. Ning, and Y. Guo, “Residual stress in pulsed DC microarc oxidation treated AZ31 alloy,” Surface Engineering, Vol. 21, pp. 1085-1090, 2012. doi: 10.1007/s11665-011-9980-6

21. G. Sheng, C.-f. Chen, and, T. Wilburn “A Study of Non-operational Dynamic Responses of Disk in 3.5 in. Hard Disk Drive to Impact Load,” J. of Microsystem Technologies, Vol. 18, No 9-10, pp. 1261-1266, 2012. doi:10.1007/s00542-012-1517-x.

22. C.-f. Chen and D. Peterson, “Stress buildup of Sn3.5Ag soldered stacked CSPs to board-level drop impact,“ IEEE Trans. Components Packaging and Manufacturing Technologies, 1(3), pp. 344-351, 2011.  DOI 10.1109/TCPMT.2010.2100290.

23. C.-f. Chen and P. C. Karulkar, “Dependence of flip chip solder reliability on filler settling,” IEEE Trans. Advanced Packaging, 32, 3, pp.1-9, 2009.  DOI 10.1109/TADVP.2008.2009357

24. C.-f. Chen and K. L. Drew, “Droplet-based microdialysis –concept, theory, and design consideration,” J. Chromatogr. A., 1209:1-2, pp. 29-36, 2008.  DOI: 10.1016/j.chroma.2008.09.006.

25. C.-f. Chen, “Effect of underfill filler settling on thermomechanical fatigue analysis of flip-chip eutectic solders,” Microelectronics Reliability, 48, pp. 1040-1051, 2008.  DOI:10.1016/j.microrel.2008.03.022.

26. C.-f. Chen and P. C. Karulkar, “Underfill filler settling effect on the die backside interfacial stresses of flip chip packages,” ASME J. Electron. Packag., 130 (3), pp. 031005-1-10, 2008.  DOI:10.1115/1.2957324.

27. S. Guruzu, M. Kulkarni, S. Ingole, G. Xu, C.-f. Chen, H. Liang, “Friction induced crystalline phase on Si,” Wear, Vol. 259, pp. 524-528, 2005.  doi:10.1016/j.wear.2005.01.016 

28. A. Wei, G. Nellis, A. Abdo, R. Engelstad, C.-f. Chen, M. Switkes, and M. Rotheschild, “Microfluidic Simulations for Immersion Lithography,” J. Microlithogr. Microfabrication, Microsyst., Vol.3, pp. 28-34, 2004.  DOI:10.1117/1.1632500. 

29. P. Reu, C.-f. Chen, R. Engelstad, E. Lovell, M. Lercel, O. Wood, and S. Mackay, “Predicting overlay performance for electron-projection lithography mask,” J. Microlithogr. Microfabrication, Microsyst., Vol. 2, pp.148-156, 2003.  DOI:10.1117/1.1563646. 

30. C-.f. Chen, R. Engelstad, E. Lovell, D. White, O. Wood, M. Smith, and L. Harriott, “Adaptive alignment of photomasks for overlay improvement,” Journal of Vacuum Science and Technology B, Vol. 20, pp. 3099-3105, 2002.  DOI: 10.1116/1.1515312. 

31. P. Reu, C.-f. Chen, R. Engelstad, E. Lovell, T. Bayer, J. Greschner, S. Kalt, H. Weiss, O. Wood, and R. Mackay, “Electron projection lithography mask format layer stress measurement and simulation of pattern transfer distortion,” Journal of Vacuum Science and Technology B, Vol. 20, pp. 3053-3057, 2002.  DOI: 10.1116/1.1521732

32. C.-f. Chen, R. Engelstad, E. Lovell, and A. Novembre, “Simulating the response of electron-beam projection lithography masks under standardized mounting techniques,” Journal of Vacuum Science and Technology B, Vol. 19, pp 2646-2651, 2001.  DOI: 10.1116/1.1409386

33. A. Jachim, C.-f. Chen, R. Engelstad, and E. Lovell, “Simulating the mechanical response of electron-beam projection lithography masks,” Journal of Vacuum Science and Technology B, 18, pp 3248-3253, 2000.  DOI: 10.1116/1.1313574

Refereed Conference Proceeding Articles (students names are underlined

1. Cheng-fu Chen, “Characterization of In-Plane Stress in TSV Array – A Unit Model Approach,” Proceedings of the 64th annual Electronic Components and Technology Conference (ECTC), Orlando, FL, May 28 – 30, 2014, pp. 2020-2026. 

2. Sheng-Tsai Wu, Cheng-fu Chen, Heng-Chieh Chien, “Interplay and Influence of Thermomechanical Stress in Copper-Filled TSV Interposers,” Proceedings of the 64th annual Electronic Components and Technology Conference (ECTC), Orlando, FL, May 28 – 30, 2014, pp. 963-966. 

3. Cheng-fu Chen, Sheng-Tsai Wu, Ming-Ji Dai, Heng-Chieh Chien, Chang-Sheng Chen, and Wei-Chung Lo, “Analytical Description of the Out-of-Plane Equivalent Mechanical Properties of Through-Silicon Via Interposers,” 2013 8th International Microsystem, Packaging, Assembly, and Circuits Technology Conference (IMPACT), Taipei, Taiwan, pp. 89-91. 

4. C.-f. Chen, “Homogenization of TSV Interposer and Quick Assessment of Its Thermomechanical Influence on 3D Packages,” Proceedings of the 63rd annual Electronic Components and Technology Conference (ECTC), Las Vegas, NV, May 29-31, 2013, 2249-2255. 

5. C.-f. Chen, “A new methodology for board-level harmonic analysis of multi-level packages,” Proceedings of the 62nd annual Electronic Components and Technology Conference (ECTC), San Diego, May 30 – June 1, 2012, 1840-1845. 

6. J. Lee and C.-f. Chen, “A new modeling strategy for the transient behavior of tire-snow interaction,” SAE Technical Paper 2012-01-0766, 2012, DOI: 10.4271/2012-01-0766. 

7. G. Sheng, T. Wilburn, and C.-f. Chen, “A study of non-operational dynamic responses of disk in 3.5 in. hard disk drive to impact load,” an extended abstract in the proceeding of the 21st Annual ASME Conference on Information Storage and Processing systems, Santa Clara, CA, June 13, , 2011. 

8. L. Chen, C.-f. Chen, T. Wilburn, and G. Sheng, “The Use of Implicit Mode Functions to Drop Impact Dynamics of Stacked Chip Scale Packaging,” Proceedings of the 61st annual Electronic Components and Technology Conference (ECTC), Orlando, FL, May 31 – June 2, 2011, pp. 2152-2157. 

9. C.-f. Chen, “Constitutive Law for Miniaturized Quantitative Microdialysis,” K.E. Herold, W.E. Bentley, and J. Vossoughi (Eds.): IFMBE Proceedings 32, pp. 77-80, 2010. 

10. V. Narravula, C.-f. Chen, and D. Peterson, “Failure Mechanism of Stacked CSP Module under Board-Level Drop Impact,” Proceedings of the 59th annual Electronic Components and Technology Conference (ECTC), San Diego, May 27-29, 2009, pp. 2039-2045. 

11. C.-f. Chen, “Constitutive law and quantification of miniaturized microdialysis,” The 6th International Conference on Nanochannels, Microchannels and Minichannels, Darmstardt, Germany, June 23-25, 2008, ICNMM2008-62346. 

12. C.-f. Chen, and P. Karulkar, “Influence of filler settling on the analysis of solder reliability of flip chip packaging,” Proceedings of the 58th annual Electronic Components and Technology Conference (ECTC), Orlando, FL, May 29 – 31, 2008, pp. 1719-1723. 

13. D. Peterson, C.-f. Chen, and P. Karulkar, “Characterization of drop impact survivability of a 3D CSP stack module,” Proceedings of the 58th annual Electronic Components and Technology Conference (ECTC), Orlando, FL, May 29 – 31, 2008, pp. 1648-1653. 

14. C.-f. Chen “Collision Detection of Moving Polygonal Mobile Robots,” Joint North America, Asia-Pacific ISTVS Conference and Annual Meeting of Japanese Society for Terramechanics, Fairbanks, AK, June 22-24, 2007. 

15. C.-f. Chen and N. K. Thammadi, “Modeling and Simulations of the Underfill Filler Settling Effect on the Interfacial Stresses of Flip Chip Packaging,” Proceedings of the 11th International Symposium on Advanced Packaging Materials, March 15-17, Atlanta, GA, 2006, pp. 51-56. 

16. C.-f. Chen, N. K. Karri, and B. R. Bracio, “Influence of Electromigration on the Reliability of Micro Switches,” Proceedings of the Seventh VLSI Packaging Workshop of Japan Technical Digest, Kyoto, Japan, Nov. 30-Dec. 2, 2004, pp. 137-140. 

17. A. Wei, G. Nellis, A. Abdo, R. Engelstad, C.-f. Chen, M. Switkes, and M. Rotheschild, “Preliminary microfluidic simulation for immersion lithography,” Proceedings of the 2003 SPIE Symposium on Emerging Lithography VI, Vol. 5040, pp. 713-723, 2003. DOI:10.1117/12.497495. 

18. C.-f. Chen, “Energy Efficient Routing for Clustered Wireless Sensors Network,” the 29th Annual Conference of the IEEE Industrial Electronics Society (IECON), Roanoke, VA, pp. 1437-1140, 2003. 

19. D. L. White, O. R. Wood, C.-f. Chen, E.G. Lovell, and R. L. Engelstad, “Complete system of nanoimprint lithography for IC production,” Proc. SPIE, Vol. 4688, 214, 2002. DOI:10.1117/12.472294. 

20. P. Reu, C.-f. Chen, R. Engelstad, E. Lovell, M. Lercel, O. Wood, and S. Mackay, “Predicting overlay and CD uniformity for the electron projection lithography mask,” Emerging Lithography Technologies VI, SPIE, Vol. 4688, pp. 547-558, 2002. DOI:10.1117/12.472280. 

21. D. White, O. Wood, C.-f. Chen, E. Lovell, and R. Engelstad, “A complete system of nano-imprint lithography for IC production,” Emerging Lithography Technologies VI, SPIE, Vol. 4688, pp. 214-222, 2002. 

22. C.-f. Chen, A. Mikelson, R. Engelstad, and E. Lovell, “Transversal response analysis of 200-mm Electron-beam projection lithography masks,” presented at SEM Annual Conference on Experimental and Applied Mechanics, June 10-12, 2002. 

23. A. Mikelson, C.-f. Chen, R. Engelstad, and E. Lovell, "Vibrational analysis of 8-in EPL masks to optimize plasma cleaning," Proc. SPIE 4343, 383 (2001). DOI:10.1117/12.436698. 

24. C.-f. Chen and K. Yuan, “Partial linearization control of a single-link flexible manipulator including third-order motor dynamics,” 8th Nat. Conf. on Mech. Eng., CSME, Taipei, Nov. 24, 1991.