CHIP FABRICATION

• MUSE Semiconductor

• CMP (Circuits Multi-Projects)

• MOSIS

CONFERENCES OF INTEREST

Integrated Circuits

• ISSCC (International Solid-State Circuits Conference) (S: Sept., P: Feb.)

• SOVC (Symposium on VLSI Circuits) (S: Jan., P: June)

• CICC (Custom Integrated Circuits Conference) (S: Nov., P: April)

• ESSCIRC (European Solid-State Circuits Conference) (S: April, P: Sept.)

• A-SSCC (Asian Solid-State Circuits Conference) (S: June, P: Nov.)

• ISLPED (International Symposium on Low Power Electronics and Design) (S: Mar., P: Aug.)

• ISCAS (International Symposium on Circuits and Systems) (S: Oct., P: May)

Semiconductor Devices

• IEDM (International Electron Devices Meeting) (S: June, P: Dec.)

• IRPS (International Reliability Physics Symposium) (S: Oct., P:April)

• SOVT (Symposium on VLSI Technology) (S: Jan., P: June)

Computer-Aided Design

• DAC (Design Automation Conference) (S: Oct., P: June)

• ICCAD (International Conference on Computer Aided Design) (S: May, P: Nov.)

• ASP-DAC (Asia and South Pacific Design Automation Conference) (S: Aug., P: Jan)

Note: S and P represent 'Submission' and 'Presentation', respectively

JOURNALS OF INTEREST

Integrated Circuits

• JSSC (IEEE Journal of Solid-State Circuits)

• TCAS-I (IEEE Transactions on Circuits and Systems I)

• TCAS-II (IEEE Transactions on Circuits and Systems II)

• TVLSI (IEEE Transactions on VLSI Systems)

Semiconductor Devices

• TED (IEEE Transaction on Electron Devices)

• EDL (IEEE Electron Device Letters)

Computer-Aided Design

• TCAD (IEEE Transactions on Computer Aided Design)