Call for Papers

Overview

Documents are communication artefacts in any form and in any media; they can be simple or compound, static or time-varying, private or open. Document engineering encompasses the study of principles, tools and processes that improve our ability to create, manage, maintain, share, and access documents.

You are invited to submit original papers to the 11th ACM Symposium on Document Engineering (DocEng 2011). Attendees at this international forum have interests that span all aspects of document engineering and the full breadth of document types and applications. DocEng is sponsored by ACM by means of the ACM SIGWEB Special Interest Group. Proceedings are available through the ACM Digital Library.

Important Dates

• Abstract submissions due April 8, 2011
• Paper submissions due April 15, 2011
• Workshop proposals due April 15, 2011
• Acceptance notice May 27, 2011

Symposium Format

DocEng is a single track conference attended by a community of academic and industrial researchers. At least one author for each paper and all workshop organizers and presenters must register.

Submission Types

Authors are invited to submit original work in one of the following forms:

• Full Papers
  • Describing complete works of research (up to 10 pages).
• Short Papers / Posters / Demos
  • Reporting on research in progress or novel challenges or visions (up to 4 pages). Short papers may be assigned to oral, poster, or demo presentation.
• Workshops
  • Describing working sessions of interest to document engineering researchers or practitioners (up to 4 pages).

All submissions will undergo a rigorous review process considering the originality of work, the quality of research or analysis of experience, the relevance to document engineering, and quality of presentation of ideas. All full papers are eligible to win the ACM SIGWEB DocEng Best Paper Award for 2011.

Support for Students

Students presenting their work at DocEng2011 will be eligible to apply for SIGWEB Student Travel Awards. Application forms and instructions are available on the website.