Research Scientist

Daniel Endean Class of 2005

"Where in high school do you learn how to estimate how many ping-pong balls could fit in Lake Michigan? When do you get build a Rube Goldberg machine that contains 50 different steps, requires electronics, chemistry, building skills, and creativity, and has to work perfectly every time? In what class do you build a mathematical model to predict how far a trebuchet will shoot? When do you get to explore fields like botany, satellite imaging, or polymer chemistry? I got to do all of this in Science Olympiad. No part of my high school career (including those advance placement and college credit classes) prepared me for my career as a scientist like Science Olympiad. Plus, it was a ton of fun!"

-Daniel Endean, Class of 2005

Research Scientist – Honeywell Aerospace, Plymouth, MN

Technical lead for the TIMU contract developing compact MEMS IMU

Primary test scientist of MEMS gyroscopes

Digital signal processor software development

Publications

Johnson B., K. Christ, D. Endean, B. Mohr, R. Supino, H. French, E. Cabuz, Tuning fork MEMS gyroscope for precision northfinding, Inertial Sensors and Systems 2015, (submitted).

Endean D., C. Weigelt, R. Victora, E. D. Dahlberg, Tunable random telegraph noise in square permalloy dots, Appl. Phys. Lett., 104, 252408 (2014).

Endean D., C. Weigelt, R. Victora, E. D. Dahlberg, Measurements of configurational anisotropy in isolated sub-micron square permalloy dots, Appl. Phys. Lett., 103, 042409 (2013).

Endean D., E. D. Dahlberg, J. Heyman, S. Maat, Quantitative Measurements of Giant Magnetoresistance at Microwave Frequencies, Phys. Rev. B, 84, 212405 (2011).

Endean D., B. Costanzi, D. Green, A. Legard, D. Olson, G. Williams, J. Engbrecht, Analysis of the Potential for sub-eV Ps Beams, Nucl. Inst. and Methods in Physics Research B, 266,502 (2007).

Endean D., E. Manlove, K. Henry, Zero-Divisor Graphs of Zn and Polynomial Quotient Rings over Zn, Rose Hulman Undergraduate Math Journal, (2007).

Patents

Endean, D., B. Martin, R. D. Horning 2015. Low temperature wafer bonding. U.S. Patent Application No. 14/722,910, filed May 2015. Patent Pending.

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