1.Grid to Chip Power Solutions

2. Planar Magnetics Modeling

3. Magnetic Components Integration

4.   High Frequency, High Efficiency, and High Power Density (3-H) Switch-Mode Power Converters

3-H power converters have been identified as one of the key challenges to achieving its vision of increased economic growth rate with a minimal environmental impact. Innovative solutions in power electronics integration will enable unprecedented performance of power converters, thereby creating unique and highly competitive solutions. Our research focuses on:

•   Advanced Circuit Topologies & Architecture (especially for resonant converters) 

•  GaN/SiC Applications & Characteristics

•  MHz Magnetic Materials and Design Methodology

5.    Wireless Power Transfer (WPT)

Wireless power transfer systems are expanding their applications toward smart machines such as service robots, automated guided vehicles, unmanned aerial vehicles, electric vehicles (EV), and many more.  Our research targets to a fast charging  with a low cost, small profile and light system as well as high transfer efficiency,  thereby focus on:

•   Topology investigation (single stage regulation), as well as advanced control scheme

•   Resonant Tanks and Coils Optimization Design

•   Coils Misalignment

•   Underwater WPT Investigation

6.   Microfabrication Inductor

It is believed that the next level of improvement in power electronics will come from high frequency integrated power modules. Magnetic components such as inductors and transformers are limiting the development. The trend toward miniaturization and integration of magnetic components poses a highly non-trivial issue to be surmounted, and is creating new challenges in the fields of electronic engineering and materials science. This research is based upon a high-level cross-disciplinary collaboration which combines the needed top expertise on micro- and nanofabrication, electronic circuit design and magnetism.