Code Multiplexed Nanocapacitor Arrays for Scalable Neural Recordings
S. Weaver, Y. Chen, A. Renz, W. Choi, Y. Vyza, T. Schlotter, K. Vulić, D. Kim, G. Atzeni, D. Momotenko, N. Nakatsuka, T. Jang, J. Vörös
bioRxiv, Feb. 2024.
A Review on Integrated RC Frequency References for IoT Applications
W. Choi
IEEE International Conference on Electronics, Information, and Communication (ICEIC), Jan. 2024.
RC Frequency References based on Dual-RC FLLs (Book Chapter)
Y. Chae and W. Choi
Biomedical Electronics, Noise Shaping ADCs, and Frequency References, Springer, Aug. 2023.
A 1,024-Channel, 64-Interconnect, Capacitive Neural Interface Using a Cross-Coupled Microelectrode Array and 2-Dimensional Code-Division Multiplexing
W. Choi*, Y. Chen*, D. Kim*, S. Weaver, T. Schlotter, C. Livanelioglu, J. Liao, R. Incandela, P. Davami, G. Atzeni, S. Arjmandpour, S.-H Cho, and T. Jang (*: Co 1st-Author)
IEEE Symposium on VLSI Technology and Circuits (VLSI), June 2023.
A Highly-Digital PWM-Based Impedance Monitoring IC with 143.2dB DR and 17.7fFrms Resolution
H. Han, W. Choi, J. Kim, J. Sung, H.-J Choi, and Y. Chae
IEEE Symposium on VLSI Technology and Circuits (VLSI), June 2023.
A Compact and PVT-Robust Segmented Duty-Cycled Resistor Realizing TΩ Impedances for Neural Recording Interface Circuits
C. Livanelioglu*, W. Choi*, D. Kim, J. Liao, R. Incandela, and T. Jang (*: Co 1st-Author)
IEEE Solid-State Circuits Letters (L-SSC), vol. 6, pp. 25–28, Jan. 2023.
A Miniaturized Wireless Neural Implant With Body-Coupled Power Delivery and Data Transmission
C. Lee, B. Kim, J. Kim, T. Jeon, W. Choi, S. Yang, J.-H. Ahn, J. Bae, and Y. Chae
IEEE Journal of Solid-State Circuits (JSSC), vol. 57, no. 11, pp. 3212–3227, Nov. 2022.
A 0.9 V 28 MHz Highly Digital CMOS Dual-RC Frequency Reference with ±200 ppm Inaccuracy from -40 °C to 85 °C
W. Choi, J. Angevare, I. Park, K. A. A. Makinwa, and Y. Chae
IEEE Journal of Solid-State Circuits (JSSC), vol. 57, no. 8, pp. 2418–2428, Aug. 2022.
A 0.0014 mm2, 1.18 TΩ Segmented Duty-Cycled Resistor Replacing Pseudo-Resistor for Neural Recording Interface Circuits
C. Livanelioglu*, W. Choi*, D. Kim, J. Liao, R. Incandela, G. Cristiano, and T. Jang (*: Co 1st-Author)
IEEE Symposium on VLSI Technology and Circuits (VLSI), pp. 62–63, June 2022.
A Miniaturized Wireless Neural Implant with Body-Coupled Data Transmission and Power Delivery for Freely Behaving Animals
C. Lee, B. Kim, J. Kim, T. Jeon, W. Choi, S. Yang, J.-H. Ahn, J. Bae, and Y. Chae
IEEE International Solid-State Circuits Conference (ISSCC), pp. 340–341, Feb. 2022.
A 64 × 64 SPAD-based Indirect Time-of-Flight Image Sensor with 2-tap Analog Pulse Counters
B. Park, I. Park, C. Park, W. Choi, Y. Na, M.-J. Lee, and Y. Chae
IEEE Journal of Solid-State Circuits (JSSC), vol. 56, no. 10, pp. 2956–2967, Oct 2021.
A 0.9V 28MHz Dual-RC Frequency Reference with 5pJ/Cycle and ±200ppm Inaccuracy from -40°C to 85°C
W. Choi, J. Angevare, I. Park, K. A. A. Makinwa, and Y. Chae
IEEE International Solid-State Circuits Conference (ISSCC), pp. 434–435, Feb. 2021.
Awarded ISSCC 2021 Takuo Sugano Award for Far-East Outstanding Paper
A 40m-Range 90fps CMOS Time-of-Flight Sensor using SPAD and In-Pixel Time-Gated Pulse Counter
B. Park, I. Park, W. Choi, Y. Na, and Y. Chae
IEEE Solid-State Circuits Letters (L-SSC), vol. 3, no. 11, pp. 422–425, Nov. 2020.
A DTMOST-Based Temperature Sensor with 3σ Inaccuracy of ±0.9°C for Self-Refresh Control in 28nm Mobile DRAM
S. Park, Y. Kim, W. Choi, Y. Lee, S. Kim, Y. Shin, and Y. Chae
IEEE Custom Integrated Circuits Conference (CICC), Mar. 2020.
A 5800μm2 Resistor-Based Temperature Sensor with a One-Point Trimmed Inaccuracy of ±1.2 °C (3σ) from −50 °C to 105 °C in 65-nm CMOS
Y. Lee, W. Choi, T. Kim, S. Song, K. A. A. Makinwa, and Y. Chae
IEEE Solid-State Circuits Letters (L-SSC), vol. 2, no. 9, pp. 67–70, Sep. 2019.
A 0.02mm2 100dB-DR Impedance Monitoring IC with PWM-Dual GRO Architecture
H. Han, W. Choi, and Y. Chae
IEEE Symposium on VLSI Technology and Circuits (VLSI), pp. C60–C61, June 2019.
A 64×64 APD-Based ToF Image Sensor with Background Light Suppression up to 200 klx Using In-Pixel Auto-Zeroing and Chopping
B. Park, I. Park, W. Choi, and Y. Chae
IEEE Symposium on VLSI Technology and Circuits (VLSI), pp. C256–C257, June 2019.
A Compact Resistor-Based CMOS Temperature Sensor with an Inaccuracy of 0.12 °C (3σ) and a Resolution FoM of 0.43 pJ·K2 in 65-nm CMOS
W. Choi, Y. Lee, S. Kim, S. Lee, J. Jang, J. Chun, K. A. A. Makinwa, and Y. Chae
IEEE Journal of Solid-State Circuits (JSSC), vol. 53, no. 12, pp. 3356–3367, Dec. 2018.
A 0.53pJ·K2 7000μm2 Resistor-Based Temperature Sensor with an Inaccuracy of ±0.35°C (3σ) in 65nm CMOS
W. Choi, Y. Lee, S. Kim, S. Lee, J. Jang, J. Chun, K. A. A. Makinwa, and Y. Chae
IEEE International Solid-State Circuits Conference (ISSCC), pp. 322–323, Feb. 2018.
A 1V 7.8mW 15.6Gb/s C-PHY Transceiver Using Tri-Level Signaling for Post-LPDDR4
W. Choi, T. Kim, J. Shim, H. Kim, G. Han, and Y. Chae
IEEE International Solid-State Circuits Conference (ISSCC), pp. 402–403, Feb. 2017.
A 0.02mm2 Embedded Temperature Sensor with ±2°C Inaccuracy for Self-Refresh Control in 25nm Mobile DRAM
Y. Kim, W. Choi, J. Kim, S. Lee, S. Lee, H. Kim, K. A. A. Makinwa, Y. Chae and T. Kim
IEEE European Solid-State Circuits Conference (ESSCIRC), pp. 267–270, Sep. 2015.