• Formlabs｜SLS Print Process R&D intern｜Somerville, MA                                                 07/2025 to 12/2025

Assisted in the development of next-generation SLS 3D printers by designing and executing experiments that refined critical component architectures, resulting in a 30% improvement in printing efficiency. In parallel, I developed Python scripts to process and analyze large volumes of experimental data, which significantly accelerated research progress and iteration cycles. Through close collaboration with cross-functional teams, I contributed to advancing both the performance and reliability of the printer platform.

• TDK｜Sensor Engineer intern｜San Jose, CA                                                                             07/2024 to 12/2024

Designed PCB layouts for a next-generation MEMS gas sensor module using Altium Designer, focusing on minimizing cross- talk and optimizing layout for compact integration. Led sensor assembly and functional validation, debugging I2Ccommunication errors and improving signal stability by 25%. Developed Python scripts to extract and visualize real-timesensor data; optimized calibration routines, reducing noise variance by 40%. Collaborated cross-functionally with materialsand firmware teams to integrate sensor prototypes into evaluation kits for customer trials.

•Haisheng Technology, CSIC｜Engineer Assistant｜Yichang, China                                   06/2018 to 08/2018 

Assembled and debugged analog front-end circuits including preamplifiers and ADCs for a fiber optic sonar system; validated signal integrity under underwater noise conditions.

•Sensitive Ceramics Research Lab, HUST｜Assistant Researcher｜Wuhan, China   01/2017 to 08/2018 

Conducted impedance spectroscopy measurements of microwave dielectric ceramics using precision LCR meters to extract permittivity, quality factor, and loss tangent across temperature and frequency ranges. Collaborated with synthesis team to fabricate Ba- and Zn-based perovskite ceramics via solid-state reaction and sintering; Simulated equivalent circuits of ceramic capacitive elements using SPICE and COMSOL to correlate microstructure with frequency-dependent dielectric performance.