IC Advanced Packaging Equipment Market Revenue was valued at USD 5.6 Billion in 2024 and is estimated to reach USD 12.8 Billion by 2033, growing at a CAGR of 9.8% from 2026 to 2033.
The IC advanced packaging equipment market was valued at USD 12.3 billion in 2022 and is expected to expand at a compound annual growth rate (CAGR) of 7.5% from 2023 to 2030. This growth is driven by the increasing demand for high performance semiconductor devices across various sectors, including consumer electronics, automotive, and telecommunications. Advanced packaging technologies, such as 3D stacking, system in package (SiP), and flip chip, are becoming integral to enhancing the performance of ICs, leading to greater adoption in these industries. Additionally, the rise of Internet of Things (IoT) applications, 5G infrastructure, and artificial intelligence (AI) is expected to further accelerate the market expansion in the coming years. Regionally, North America held a significant share of the IC advanced packaging equipment market in 2022, contributing approximately 30% of the overall revenue. This dominance can be attributed to the strong presence of key semiconductor manufacturers and increasing investments in research and development. The Asia Pacific region is anticipated to witness the highest growth, with a CAGR of 8.2%, driven by the rapid industrialization of countries such as China, Japan, and South Korea, along with the expanding semiconductor production capacity. Europe and the Middle East & Africa are also expected to contribute to the market growth, fueled by the demand for advanced packaging solutions in automotive and industrial applications.
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ASM Pacific
Applied Material
Advantest
Kulicke&Soffa
DISCO
Tokyo Seimitsu
BESI
Hitachi
Teradyne
Hanmi
Toray Engineering
Shinkawa
COHU Semiconductor
TOWA
SUSS Microtec
By the year 2030, the scale for growth in the market research industry is reported to be above 120 billion which further indicates its projected compound annual growth rate (CAGR), of more than 5.8% from 2023 to 2030. There have also been disruptions in the industry due to advancements in machine learning, artificial intelligence and data analytics There is predictive analysis and real time information about consumers which such technologies provide to the companies enabling them to make better and precise decisions. In addition, new innovative techniques such as mobile surveys, social listening, and online panels, which emphasize speed, precision, and customization, are also transforming this particular sector.
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Growing demand for below applications around the world has had a direct impact on the growth of the Global IC Advanced Packaging Equipment Market
Wafer Level Packaging Equipment
Chip-on-Board (COB) Packaging Equipment
Flip-Chip Packaging Equipment
System-in-Package (SiP) Packaging Equipment
Fan-Out Wafer-Level Packaging (FOWLP) Equipment
Others
Die Bonders
Wire Bonders
Encapsulation Equipment
Test and Inspection Equipment
Others
3D Packaging
2.5D Packaging
Advanced Substrate Packaging
Flip-Chip Technology
Other Technologies
Consumer Electronics
Telecommunications
Automotive
Industrial
Medical Devices
Others
Foundries
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT) Providers
Other End Users
US (United States, US and Mexico)
Europe (Germany, UK, France, Italy, Russia, Turkey, etc.)
Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam)
South America (Brazil, Argentina, Columbia, etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
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1. Introduction of the Global IC Advanced Packaging Equipment Market
Overview of the Market
Scope of Report
Assumptions
2. Executive Summary
3. Research Methodology of Verified Market Reports
Data Mining
Validation
Primary Interviews
List of Data Sources
4. Global IC Advanced Packaging Equipment Market Outlook
Overview
Market Dynamics
Drivers
Restraints
Opportunities
Porters Five Force Model
Value Chain Analysis
5. Global IC Advanced Packaging Equipment Market, By Type
6. Global IC Advanced Packaging Equipment Market, By Application
7. Global IC Advanced Packaging Equipment Market, By Geography
US
Europe
Asia Pacific
Rest of the World
8. Global IC Advanced Packaging Equipment Market Competitive Landscape
Overview
Company Market Ranking
Key Development Strategies
9. Company Profiles
10. Appendix
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