I was working on a test point to component csv parser file to see if I could find test points that were too close to each other according some clearance rules and the scope expanded beyond what i'm capable of right now on the software side of things. While still working on this project for my own sake, I wanted to know if there was already a feature of OrCAD PCB Designer where I could see a report of test points that are too close to components or that would at least display distances between components, if they're on the top or bottom. I would like the edge to edge distances between the test points and components.

You can set a distance between component outline and testpoint but this is a uniq value used for all components. it can be set relative to package geometry assembly (be aware in this case that assembly NEEDS to be closed to be considered as an obstable; if not testpoint can be under.) or place boundary.


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Thanks for getting back to me. The issue is sometimes when we send the board to the contract manufacturer CM, even though we have set clearance rules, they say that some of the board violates the clearance rules as far as test points and components. Not all the test points and components violate the distance clearance between each other, but some of them do. I was wondering if there was a way to generate a report of the tps that violate the tp to tp clearance rule and tp to component clearance rule. If that makes more sense or no sense...

Second, allegro check test point distance between them only when generated: if test point (position and /or definition) then you have to recheck it.. To do this, i use the testpoint resequence with remove testpoint too close active: if some testpoint are removed it is likely they where moved after generation.

Second, on Android app testing you can supply your APK file or a link to download from while with iOS app tests you need an enterprise/testflight license or a link to the Appstore for testers to install.

To become a Testpoint tester, a tester goes through a tough screening process where Testpoint verifies that the tester can communicate and correspond well in english. Second, a tester goes through an online exam to check how many and how well he finds the implemented bugs in it.


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If the testpoints were added using testprep or the automatic testpoint functionality inside PCB editor then the testpoints are labelled using the class/subclass Manufacture/Probe_Top otr Probe_Bottom so if you just turn on that layer that may should you what you need,

This is the library I used for surface test points (for pogo test pins) If you plan on getting stencils made, make sure the test pads are not present in your solder paste layer. I forgot to check this and my stencils have cut outs on all the test points. I have to manually scrub the paste off.

I find it odd to have test points on a board with no way in the schematic to tell what they are connected to. Tracing a connection on the board to ensure you know what you are measuring seems cumbersome.

Hi,

Can any come up with a clever way to export a test point list with net name connections and coordinates? My EMS requires such a file to develop the adapter boards for production testing. I know I can have the testpoints in the pick&place files.

Like here, in my test point footprint, I added the pad and reference text to layer User.Eco1. In PCB Editor, I have renamed User.Eco1 to User.Testpoints and it still shows as expected.

Footprint editor:

image13411092 46.1 KB

Modern miniature surface-mount electronics often simply have a row of unlabelled, tinned solder pads. The device is placed into a test fixture that holds the device securely, and a special surface-contact connector plate is pressed down onto the solder pads to connect them all as a group.

I have an 8 layer thru-hole board, I want to put surface mount type pads on just the bottom to be used as test points for part of a 72 pin connector and a 68 pin IC. So far, I cannot get the supplied test points to come in on just the bottom or they have drilled holes.

You can create a new component with only one SMT pad and use that as the test point. You should add the testpoint in your schematic as well because you need this it to be part of the netlist and also, if you forward annotate and if the testpoint is not in the netlist, Ultiboard will remove it from the board.

This surface mount test point is on the bottom of the board. I cannot make a sm padon the bottom layer. How do you put a surface mount component on the bottom of the board in Ultiboard? I know how to do it in many other programs, but I cannot find a way to do it here. This has to be done 140 tomes.

Currently I am able to change the outcome of a test point using it's testpointID in the API.Below is the API: {organization}/{project}/_apis/test/Plans/{planID}/Suites/{suiteID}/points/{testpointID}?api-version=5.0

Since obtaining the test point IDs through another API call is an additional step, I would like to know if there is any way to make the first outcome updation call using the test case name or test case ID?

Just updated my Mini+ to the Alpha firmware and have sliced a file using the new Input Shaping profile on Prusa Slicer. I have noticed my Mini is now pressing into the bed when auto bed levelling on point 6. All test other test points are working well. Bed is flat and I have tried both the Texutred PEI and smooth sheets.

Thanks for the help. Unfortunately the printer was working great before the firmware update, I even did a test benchy so I could compare speeds before and after. The printer hasn't been changed in any way other than the software update.

Started working with altium at a new job, designing a board that uses test Points that are made as components a pad with an arc around it, silimiar to this altium guide the problem I'm having is the board is intended for bed of nails testing, and as such there are specified clearance rules which we've added as design rules test Points must be 1.5mm from components 1.2 from other TP, however no matter where I placed the test point it always fails design rule check for 1.5mm clearance, as well as being illegally under a component, so I allowed placement under component and the last issue went away, this leads me to believe the test Points are "colliding" with themselves. Some pictures The test Points need to stay in a form where they are marked on the schematic, and my understanding is ordinary added pads don't show up on the schematic. is there a way to resolve this?

In the image below, I got the colour plot with test points by using the grid-based simulation. But I am not sure if the illuminance values written are the average of that little square, or infinitely small single test point value?


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