E-Beam Evaporation System for Metal and Oxides Deposition (Shared Facility)
Work station for computational work
Muffle Furnace (Temperature beyond 1200 degree)
Vacuum Oven (up to 400 degree)
AC Motor Spin coater (up to 10000 rpm)
Weighing Machine Balancer
Ultrasonicator
Magnetic Stirrer (Hot Plate)
Deionized (DI) Water System
Vibration-free Optical Bench with the Following Facilities:
Vacuum-equipped temperature-dependent current-voltage measurement probe station
In-house high-density Memory Chip and Wafer-level Electrical Characterization Facilities
ArC ONE Memory measurement system
Optoelectronic Characterization Facility with Different Light Sources
ArC ONE Memory Measurement System
ArC ONE Memory Measurement Tool Integration with Wafer-level Measurement System
User-friendly Testing Interface with ArC ONE Tool
Established testing Protocols for High-density Crossbar Array Measurement
Autolab for CV, EIS and AC Analysis Facility
High Resolution-Transmission Electron Microscope (HR-TEM)
Field Emission Scanning Electron Microscope (FE-SEM)
X-Ray Diffraction (XRD)
Scanning Probe Microscope (SPM)
HR-XRD
X-ray Photoelectron Spectroscopy (XPS)
Field Emission Scanning Electron Microscope with E-Beam Lithography and Reactive Ion Etching