2025
S. H. Lim, G. Kim, S. Cho, Y. K. Kim, E. B. Ko, S. Y. Choi, J. A. Heo, D. Kim, H. Yoo, S.-Y. Lee, Y. Kim, P.-R. Cha, D. Y. Lee, S. Lee, B. C. Jang, Y. Kim, H. H. Kim*, Ultrafast and Universal Synthetic Route for Nanostructured Transition Metal Oxides Directly Grown on Substrates, Advanced Materials
Y. Jung, W. Joo, K. R. Lee, C. Kim, M.-J. Choi, Y.-C. Joo*, S.-Y. Lee*, In-situ Stress Analysis of Nickel Nanoparticle Sintering with Metal Additive in Multi-Layer Ceramic Capacitors, Electronic Materials Letters
J. A. Heo, M. C. Park, I. Nam, and S.-Y. Lee*, Reliability of Fatigue Deformation for Flexible Substrate-Metal Thin Film System Varying Interfacial Adhesion, Journal of Microelectronics and Packaging Society
Y.-G. Lee, H. Kim, J. Hyun, J. Sohn, J.-M. Lim, D.-Y. Lee, Y.-C. Joo* and S.-Y. Lee*, A Distribution-Dependent Grain Size Measurement for the Accurate Property Prediction of Ruthenium Interconnects, Materialia
2024
H. Kim, U.-G. Kim, D. Hong, S. Kim, S. Han, Y.-C. Joo* and S.-Y. Lee*, Bonding Structure and Dry Etching Characteristics in Amorphous B-C-N Films for Hardmask Applications, Carbon
S. Lee, J.-M. Shin, J. H. Hyun, I.-S. Choi, Y.-C. Joo, B.-J. Kim* and S.-Y. Lee*, “Effect of Ag agglomeration-driven nanovoids formation on fatigue reliability of Cu-Ag alloy flexible interconnects”, Journal of Materials Research and Technology
J. Y. Hwang, D. Kim, H, Jang*, S.-Y. Lee*, Y.-C. Joo*, Thermal and Electrical Properties Depending on the Bonding Structure of Amorphous Carbon Thin Films, Electronic Materials Letters
J. A. Heo, J. H. Hyun, C. Y. Kim, S. H. Jeon, and S.-Y. Lee*, Reliability of fatigue deformation for flexible Cu interconnect varying interfacial adhesion, Journal of Microelectronics and Packaging Society
2023
M. J. Kim, J. A. Heo, J. H. Hyun, and S.-Y. Lee*, "Reliability of Cu Interconnect under Compressive Fatigue Deformation Varying Interfacial Adhesion Treatment", J. Microelectron. Packag. Soc.
S. J. Oh, J. Yu, S. Cheon, S. H. Lee, S.-Y. Lee and T. Lee*, "Anisotropic microstructural evolutions of extruded ZK60 Mg alloy subjected to electropulsing treatment", Journal of Materials Research and Technology
S. Kim, U. Kim, J. Ryu, D.-k. Kim, M. Kim, Y.-C. Joo and S.-Y. Lee*, “Boron-doped amorphous carbon deposited by DC sputtering for a hardmask: Microstructure and dry etching properties”, Applied Surface Science
S. Park, S.-H. Kim, S. Lee and S.-Y. Lee*, "Control of Poisson’s Ratio of PDMS Substrate for Wearable Device through Designing Porogen Materials", Journal of Next-generation Convergence Technology Association
S. Kim, M.-W. Jung, K. Kim, U. Kim, M. Kim, S.-Y. Lee* and Y.-C. Joo*, “Effect of N doping on the microstructure and dry etch properties of amorphous carbon deposited with a DC sputtering system”, RSC Advances
2021
C. Kim, K. Son, G. Kim, S. Kim, S.-K. Lee, S.-Y. Lee, Y.-B. Park* and Y.-C. Joo*, “A study on the interfacial adhesion energy between capping layer and dielectric for Cu interconnects”, Microelectronics Reliability
I.-K. Ahn, S.-Y. Lee, H. G. Kim, G.-B. Lee, J.-H. Lee, M. Kim and Y.-C. Joo*, “Electrochemical oxidation of boron-doped nickel–iron layered double hydroxide for facile charge transfer in oxygen evolution electrocatalysts”, RSC Advances
2020
J.‑C. Lee, J.‑S. Lee, P. Won, J. J. Park, S. H. Choi, S. H. Ko, B.‑J. Kim, S.‑Y. Lee*, Y.‑C. Joo*, “Operation Range‑Optimized Silver Nanowire Through Junction Treatment”, Electronic Materials Letters
C. Kim, H. Shen, J. Yoon, M.-W. Jeong, S. Kim, S.-H. Oh, S.-Y. Lee, Y. Joo, H. Lee* and Y.-C. Joo*, ”Planar-Radial Structured Thermoelectric Cooler for Local Hot Spot Cooling in Mobile Electronics”, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
2019
Selective crack suppression during deformation in metal films on polymer substrates using electron beam irradiation, S.-Y. Lee, G. R. Park, S.-G. Kang, J.-H. Lee, E.-C. Jeon, C.-H. Shim, J.-P. Ahn, D.-I. Kim, H. N. Han, Y.-C. Joo*, C. Kim* and I.-S. Choi*, Nature Communications
Bonding structure and etching characteristics of amorphous carbon for a hardmask deposited by DC sputtering, S.-Y. Lee, K.-T. Jang, M.-W. Jeong, S. Kim, H.-Y. Park, G.-T. Kim, G.-D. Lee, M.-Y. Kim, and Young-Chang Joo*, Carbon
Metal-organic Framework driven Porous Cobalt Disulfde Nanoparticles Fabricated by Gaseous Sulfurization as Bifunctional Electrocatalysts for Overall Water Splitting, I.-K. Ahn, W. Joo, J.-H. Lee, H. Kim, S.-Y. Lee, Y. Jung, J.-Y. Kim, G.-B. Lee, M. Kim, and Y.-C. Joo*, Scientific Reports
Stable Interconnect System for Horizontal Thermoelectric Coolers by Thermodynamic‑Based Prediction, M.‑W. Jeong, S.‑Y. Lee, H.‑B. Park, H.‑J. Lee, and Y.‑C. Joo*, Electronic Materials Letters
Effect of the Thermal Annealing on the Stretchability and Fatigue Failure of the Copper Film on the Polymer Substrate, D.-J. Lee, J.-S. Lee, T.-W. Kim, S.-Y. Lee, Y.-B. Park, Y.-C. Joo, and B.-J. Kim*, Journal of Electronic Materials
~ 2018
Transmission Orientation Imaging of Copper Thin Films on Polyimide Substrates Intended for Flexible Electronics, S.-Y. Lee, H.-W. Guim, D.-I. Kim, Y.-C. Joo, C.-H. Shim, J.-P. Ahn, I.-S. Choi, and M. Abbasi*, Scripta Materialia
Electrophoretic kinetics of concentrated TiO₂ nanoparticle suspensions in aprotic solvent, S.-Y. Lee, J.-R. Yim, I.-S. Choi, K. T. Nam, S.-H. Lee and Y.-C. Joo*, Electronic Materials Letters
Improved Battery Performance of Nanocrystalline Si Anodes Utilized by Radio Frequency (RF) Sputtered Multifunctional Amorphous Si Coating Layers, I.-K. Ahn, Y.-J. Lee, S.-K. Na, S.-Y. Lee, D.-H. Nam, J.-H. Lee*, and Y.-C. Joo*, ACS Applied Materials & Interfaces
Electromigration Characteristics and Morphological Evolution of Cu Interconnects on CVD Co and Ru Liners for 10-nm Class VLSI Technology, K.-T. Jang, S.-Y. Lee, S.-K. Na, S.-K. Lee, J.-M. Baek, W.-K. You, O.-H. Park, R.-H. Kim, H.-S. Oh, and Y.-C. Joo*, IEEE Electronic Device Letters
2D reentrant auxetic structures of graphene/CNT networks for omnidirectionally stretchable supercapacitors, B. S. Kim, K. Lee, S. Kang, S.-Y. Lee, J. B. Pyo, I.-S. Choi, K. Char, J. H. Park, S.-S. Lee, J. Lee and J. G. Son*, Nanoscale
Tunable Sn Structures in Porosity-Controlled Carbon Nanofibers for All-Solid-State Lithium-Ion Battery Anodes, D.-H. Nam, J. W. Kim, J.-H. Lee, S.-Y. Lee, H.-A-S. Shin, S.-H. Lee, and Y.-C. Joo*, Journal of Materials Chemistry A
One-step structure modulation of electrospun metal-loaded carbon nanofibers: Redox reaction controlled calcination, D.-H. Nam, J.-H. Lee, N.-R. Kim, Y.-Y. Lee, H.-W. Yeon, S.-Y. Lee, and Y.-C. Joo, Carbon
Electrical current-induced gradual failure of crystalline Ge2Sb2Te5 for phase-change memory, Y.-J. Park, T.-Y. Yang, J.-Y. Cho, S.-Y. Lee, and Y.-C. Joo*, Applied. Physics Letters
Enhanced conductivity of solution-processed indium tin oxide nanoparticle films by oxygen partial pressure controlled annealing, N.-R. Kim, J.-H. Lee, Y.-Y. Lee, D.-H. Nam, H.-W. Yeon, S.-Y. Lee, T.-Y. Yang, Y.-J. Lee, A. Chu, K. T. Nam, and Y.-C. Joo*, Journal of Materials Chemistry C
TKD와 ASTAR를 이용한 유연소자용 금속 박막의 기계적 변형에 따른 미세구조 분석, 대한금속·재료학회 춘계학술대회 재료 미세구조와 물성의 첨단 제어 및 예측 기술 심포지엄, 2024
Improving mechanical-electrical reliability of Cu interconnects based on the microstructure analysis, 제31회 한국반도체학술대회, 2024
Characterization of microstructures of metal thin film for flexible electronics based on TKD and ASTAR™, 대한금속·재료학회 제10회 첨단 융복합 분석기술 심포지엄, 2023
Characterization of microstructures of metal thin film for flexible electronics based on TKD and ASTAR™, (사)한국마이크로전자 및 패키징학회 춘계학술대회, 2023
Large Plastic Deformation in Nanocrystalline Metal, International Conference on Electronic Materials and Nanotechnology for Green Environment, 2022
전자빔 조사 계면 제어 기술을 통한 인장변형 감응형 OLED 소자 제작, 대한금속·재료학회 춘계학술대회대경지부 학술 발표회, 2022
Twin-mediated deformation of Copper nanothin film at high elongation strain, 마이크로나노시스템학회 영남지역분회 심포지엄, 2022
Characterization of microstructures of metal thin film for flexible electronics based on TKD and ASTAR™, 한국현미경학회 춘계학술대회, 2022
최인석, 이소연, 이지훈, 주영창, "유기물과 금속의 복합체", 10-1669981, 2016
이소연, 현준혁, 김은정, 주영창, 이선기, "전자소자 배선용 구리-알루미늄 합금 및 이의 제조 방법", 10-2023-0145991, 2023
김병준, 신재명, 이소연, 최인석, 주영창, 이선기, "Cu-Ag 합금 소재, 그의 제조 방법 및 그를 포함하는 스트레처블/폴더블 전자소자", 10-2023-0195677, 2023