Publications

Im, Byoungyong, Sunjung Kim, and Soo-Hyun Kim. "Nucleation-controlled growth of Cu thin films electrodeposited directly on ALD Ru diffusion barrier in additive-free electrolyte for Cu interconnect." Microelectronic Engineering 275 (2023): 111991. 

Im, B., Mun, K., Kim, S., & Kim, S. H. Seedless electrodeposition of Cu thin films on ALD Ru diffusion barriers with different electrical properties. Electrochimica Acta (2023), 443, 141971. 

Bora Ye, Sunjung Kim, Study on the thermal treatment conditions for fabricating open-cell structure Cu–Sn alloy foams, Journal of Alloys and Compounds, Volume 853, February 2021, 157006 

Byoungyong Im, Sunjung Kim, Soo-Hyun Kim, Influence of additives upon Cu thin film growth on atomic-layer-deposited Ru layer and trench-filling by direct electrodeposition, Thin Solid Films, Volume 636, August 2017, Pages 251-256

Bosung Seo, Sunjung Kim, Cobalt extraction from tungsten carbide-cobalt (WC-Co) hard metal scraps using malic acid, International Journal of Mineral Processing, Volume 151, June 2016, Pages 1-7

Sumin Lee, Sunjung Kim, Electrochemical synthesis and characterization of erbium oxide, Ceramics International, Volume 42, Issue 16, December 2016, Pages 18425-18430

Kang O Kim, Sunjung Kim, Surface Morphology Control of Cu–Ag Alloy Thin Film on W Diffusion Barrier by Seedless Electrodeposition,  Journal of Nanoscience and Nanotechnology, Volume 16, Number 11, November 2016, pp. 11701-11706(6) 

Kang O Kim, Sunjung Kim, Nano-Nucleation Characteristic of Cu–Ag Alloy Directly Electrodeposited on W Diffusion Barrier for Microelectronic Device Interconnect, Journal of Nanoscience and Nanotechnology, Volume 16, Number 5, May 2016, pp. 5173-5178(6)

Bora Ye, Sunjung Kim, Formation of Nanocrystalline Surface of Cu–Sn Alloy Foam Electrochemically Produced for Li-Ion Battery Electrode, Journal of Nanoscience and Nanotechnology, Volume 15, Number 10, October 2015, pp. 8217-8221(5) 

Byoungyong Im, Sunjung Kim, Surface morphology evolution of Cu thin films electrodeposited directly on ti diffusion barrier in citric acid, Journal of The Electrochemical Society, Volume 162, Number 10,  July 2015, pp D491-D496 (6)

Jieun Lee, Sunjung Kim, Doyun Shin, Electrolytic recovery of Fe from Cu smelter slag in nitric acid solution, Journal of Applied Electrochemistry 45(3):281-288, February 2015 

Binh Ha Bui, Sunjung Kim, Preparation of Cu-Sn Alloy Foam by Electrodeposition in Acid Solution, Journal of The Electrochemical Society, Volume 162, Number 1 , November 2014, pp. D15-D19 (56) 

Jieun Lee, Sunjung Kim, Doyun Shin, Electrodeposition of Iron in HNO3 Solution Containing Iron Dissolved from Copper Slag, Journal of The Electrochemical Society, Volume 161, Number 14, September 2014, D719-D724 (6)

Byoungyong Im, Sunjung Kim, Nucleation and Growth of Cu Electrodeposited Directly on W Diffusion Barrier in Neutral Electrolyte, Electrochimica Acta, Volume 130, June 2014, Pages 52-59 (8)

Sunjung Kim, Bosung Seo, Seong-HoSon, Dissolution behavior of cobalt from WC–Co hard metal scraps by oxidation and wet milling process, Hydrometallurgy, Volume 143, March 2014, Pages 28-33

Byoungyong Im, Sunjung Kim, Effect of bath additives on copper electrodeposited directly on diffusion barrier for integrated silicon devices, Thin Solid Films, Volume 546, 1 November 2013, Pages 263-270

Sunjung Kim, Luda Lee, Characteristics of Electrodeposited Cu-Co Alloy Substrate for Vertical Structure GaN-Based LEDs, Journal of The Electrochemical Society, Volume 159, Number 6, March  2012, D341-D346 (6)

Sunjung Kim, Vertical Structure GaN-Based Light Emitting Diodes with Electrochemically Deposited Stress-Free Nickel Substrate, Journal of The Electrochemical Society, Volume 159, Number 4, January  2012, D196-D199  (4)

Luda Lee and Sunjung Kim, Formation of Cu Substrates with W Addition for Vertical Structure Light Emitting Diodes using Electroplating Method, Journal of The Electrochemical Society, Volume 159, Number 1, December 2011

Kye-Sun Park and Sunjung Kim, Corrosion and Corrosion Fatigue Characteristics of Cast NAB Coated with NAB by HVOF Thermal Spray, Journal of The Electrochemical Society, Volume 158, Number 10, August  2011, C335-C340 (6)

Sunjung Kim, Effect of Residual Stress of Thin and Thick Layers on Laser Lifted-Off Light Emitting Diodes, Journal of The Electrochemical Society, Volume 158, Number 9, July  2011, H904-H907 (4)

Kye-Sun Park, Sunjung Kim, Seedless Copper Electrodeposition onto Tungsten Diffusion Barrier, Journal of The Electrochemical Society, Volume 157, Number 12, October 2010, D609-D613 (5)

Sunjung Kim, Kye-Sun Park and Soo-Hyun Kim, Electrochemical Formation of Cu Nanowires on W Surface Patterned by Atomic Force Microscope Tip, Journal of The Electrochemical Society, Volume 14, Number 11, September 2011, D103-D106 (4)

Sunjung Kim, Seedless Copper Electrodeposition onto Tantalum Diffusion Barrier by Two-Step Deposition Process,  Electrochemical and Solid State Letters, Volume 13, Number 7, September 2010, Pages D83-D86 (4)

Sunjung Kim, Photoresist Passivation Structures for Laser Lifted-Off Light Emitting Diodes,  Electrochemical and Solid State Letters, Volume 13, Number 7, April 2010, Pages H240-H243

Sunjung Kim, Improvement of interfacial adhesion in vertical GaN-based LEDs by introducing O2 plasma cleaning and intermediate layers,  Applied Surface Science, Volume 256, Issue 13, April 2010, Pages 4157-4161

Sunjung Kim, Effect of Interfacial Properties of p-GaN/Sputter-Deposited NiAg-Based Electrode on Optical Properties of Vertical GaN-Based LEDs,  Electrochemical and Solid State Letters, Volume 12, Number 12, October 2009, Pages H441-H444 (4)

Sunjung Kim, Jun-Ho Jang, Jeong-Soo Lee, Thermally Stable and Highly Reflective ITO/Ag-Based Ohmic Contacts to p-GaN, Journal of the Electrochemical Society, Volume 154, Number 11, September 2007, H973 

Sunjung Kim, Jun-Ho Jang, Jeong-Soo Lee, and David J. Duquette, Stress behavior of electrodeposited copper films as mechanical supporters for light emitting diodes,  Electrochimica Acta, Volume 52, Issue 16, 30 April 2007, Pages 5258-5265

Sunjung Kim and David J. Duquette, Morphology Control of Copper Growth on TiN and TaN Diffusion Barriers in Seedless Copper Electrodeposition, Journal of The Electrochemical Society, Volume 154, Number 4, February 2007, D195-D200 (4)

Sunjung Kim and David J. Duquette, Growth of conformal copper films on TaN by electrochemical deposition for ULSI interconnects, Surface and Coatings Technology, Volume 201, Issue 6, 4 December 2006, Pages 2712-2716

Sunjung Kim and David J. Duquette, Quantitative Measurement of Interfacial Adhesion Between Seedless Electrodeposited Copper and Tantalum-Based Diffusion Barriers for Microelectronics,  Electrochemical and Solid State Letters, Volume 10, Number 12, November 2006, Pages D6-D9 (4)

Sunjung Kim and David J. Duquette, Nucleation Characteristics of Directly Electrodeposited Copper on TiN, Journal of the Electrochemical Society, Volume 153, Number 9,  21 July 2006, C673-C676

Sunjung Kim and David J. Duquette, Effect of Chemical Composition on Adhesion of Directly Electrodeposited Copper Film on TiN, Journal of the Electrochemical Society, Volume 153, Number 6, 13 April 2006, C417-C421

Sunjung Kim and David J. Duquette, Multiple Bath Usage for Adhesion Enhancement of Directly Electrodeposited Copper on TaN, Electrochemical and Solid-State Letters, Volume 9, Number 2, 14 December 2005, C38-C40