Oct. 2018
Sonny’s co-authored paper, “Wideband 39 GHz Vertically-Polarized Endfire Antenna-in-Package (AiP) Array featuring Near-Planar Profile,” won 1st place in the Student Paper Award at the IEEE International Symposium on Antennas and Propagation. This paper describes an extremely thin antennain-package (AiP) with integrated 5G vertically-polarized endfire antenna arrays for millimeter-wave applications. This paper presents an ultra-thin antenna-in-package (AiP) with integrated 5G vertically-polarized endfire antenna arrays for millimeter-wave applications. The AiP, with a height less than 0.1λ0, is compatible with compact device integration and was fabricated using multi-layer LTCC.
Thank you, Junho, for your initiative, and Prof. Wonbin Hong for your guidance.