Laser Manufacturing

Advanced Laser Manufacturing for Soft Electronics

Our lab explores Advanced Laser Processing techniques to overcome the limitations of conventional lithography and enable the fabrication of next-generation soft and stretchable electronics. By leveraging the non-contact, high-precision, and selective heating capabilities of lasers, we develop optimized processes to fabricate high-performance electrodes and sensors on heat-sensitive polymer substrates with rapidity and precision.

1. Laser Ablation

A subtractive manufacturing process that utilizes high-energy laser pulses to selectively remove or cut materials.

• Micro-channel Fabrication: Creating micro-scale channels or patterns on flexible substrates to house liquid metal for stretchable sensors and interconnects.

• Precision Patterning: High-resolution patterning of conductive thin films or insulating layers to realize complex circuit designs without physical masks.

2. Laser Sintering 

A technique that selectively creates conductive paths by sintering metal nanoparticles (Ag, Cu) or pastes on flexible substrates.

• Conductive Trace Formation: Rapidly creating high-conductivity circuits from printed inks (via inkjet or screen printing) by fusing particles.

• Low-thermal Budget: Minimizing thermal damage to heat-sensitive substrates (e.g., PET, TPU) by localizing heat energy only to the target conductive materials.

3. Laser Induced Graphene (LIG)

A direct-writing process that converts carbon precursors, such as commercial Polyimide (PI) films, into porous graphene via laser irradiation.

• One-step Fabrication: Generating flexible graphene electrodes directly in ambient air without the need for vacuum deposition or transfer processes.

• Sensor Applications: Utilizing the high surface area of LIG for high-sensitivity physical/chemical sensors and energy storage devices like supercapacitors.

4. Laser Annealing (Thermal Treatment)

A post-processing technique designed to maximize the physical and electrical properties of fabricated devices.

• Property Enhancement: Improving device performance by lowering the junction resistance of metal nanowire networks or enhancing the crystallinity of semiconductor thin films.

• Interface Engineering: Strengthening the interfacial adhesion between heterogeneous materials to ensure the mechanical durability of stretchable electronics.