Publications

Updated May 2020

Journal Papers

  1. Min-gu Kim*, Byeongyong Lee*, Mochen Li, Suguru Noda, Choongsoon Kim, Jayoung Kim, Woo-Jin Song, Seung Woo Lee, Oliver Brand, ACS Nano, accepted. (IF=13.903)
  2. Min-gu Kim, Devin K. Brown, Oliver Brand, "Nanofabrication for all-soft and high-density electronic devices based on liquid metal", Nature Communications, vol. 11, pp. 1002, 2020. (IF=11.88) Link
  3. Pyungwoo Yeon, Min-gu Kim, Oliver Brand, Maysam Ghovanloo, "Optimal Design of Passive Resonating Wireless Sensors for Wearable and Implantable Applications", IEEE Sensor Journal, vol. 19, pp. 7460-7470, 2019. (IF=3.076) Link
  4. Hommood Alrowais, Patrick Getz, Min-gu Kim, Jin-Jih Su, Reginald Tran, Wilbur A. Lam, Oliver Brand, “Bio-inspired fluidic thermal angular accelerometer with inherent linear acceleration rejection”, Sensors and Actuators A: Physical, vol. 279, pp. 566-579, 2018. (IF=2.739) Link
  5. Min-gu Kim, Choongsoon Kim, Hommood Alrowais, Oliver Brand, “Multiscale and uniform liquid metal thin-film patterning based on soft lithography for 3D heterogeneous integrated soft microsystems: additive stamping and subtractive reverse stamping approaches", Advanced Materials Technologies, vol. 3, pp. 1800061, 2018. (IF=5.395) Link
  6. Min-gu Kim, Hommood Alrowais, Oliver Brand, “3D integrated and multifunctional all-soft physical microsystems based on liquid metal for electronic skin applications”, Advanced Electronic Materials, vol. 4, pp. 1700434, 2018. (IF=6.312) Link
  7. Min-gu Kim, Hommood Alrowais, Choongsoon Kim, Pyungwoo Yeon, Maysam Ghovanloo, Oliver Brand, “All-soft, battery-free, wireless chemical sensing platform based on liquid metal for liquid- and gas-phase VOC detection”, Lab on a Chip, vol. 17, pp. 2323-2329, 2017. (IF=6.914) Link
  8. Min-gu Kim, Hommood Alrowais, Spyridon Pavlidis, Oliver Brand, “Size-scalable and high-density liquid metal-based soft electronic passive components and circuits using soft lithography”, Advanced Functional Materials, vol. 27, pp. 1604466, 2017. (IF=15.621) Link
  9. Dong-Hyun Kang, Min-gu Kim, Hye-Kyoung Seo, Yong-Jun Kim, “An anti-adhesion technique in microfluidic channel using dielectrophoresis for particle processing microfluidic chip applications”, Journal of Biomedical Nanotechnology, vol. 11, pp. 1524-1534, 2015. (IF=5.068) Link
  10. Min-gu Kim, Sang Moon Cho, Joong-Kyung Kim, “Prediction and evaluation of the cooling performance of radiators used in oil-filled power transformer applications with non-direct and direct-oil-forced flow”, Experimental Thermal and Fluid Science, vol. 44, pp. 392-397, 2013. (IF=3.493) Link – Corresponding Author
  11. Min-gu Kim, Yong-Ho Kim, Chul Woo Park, Hong-Lae Kim, Dong-Hyun Kang, Jungho Hwang, Yong-Jun Kim, “An integrated miccrochannel with continuous electrodynamic anti-adhesion capability for particle loss reduction in air-based microfluidic chips”, Journal of Adhesion Science and Technology, vol. 27, pp. 2517-2530, 2013. (IF=1.21) Link
  12. Hong-Lae Kim, Min-Gu Kim, Chungkeun Lee, Jong-Ho Lee, Yong-Jun Kim, “Miniaturized one-point detectable electrocardiography sensor for portable physiological monitoring systems”, IEEE Sensors Journal, vol. 12, pp. 2423-2424, 2012. (IF=3.076) Link
  13. Yong-Hwan Choi, Min-gu Kim, Dong-Hyun Kang, Jaesam Sim, Jongbaeg Kim, Yong-Jun Kim, “An electrodynamic preconcentrator integrated thermoelectric biosensor chip for continuous monitoring of biochemical process”, Journal of Micromechanics and Microengineering, vol. 22, pp. 045022, 2012. (IF=2.141) Link
  14. Dong-Hyun Kang, Min-gu Kim, Yong-Jun Kim, “Particle loss reduction technique using dielectrophoresis in microfluidic channel”, Journal of Sensor Science and Technology, vol. 20, pp. 357-362, 2011. Link
  15. Min-gu Kim, Yong-Ho Kim, Hong-Lae Kim, Chul Woo Park, Yun-Haeng Joe, Jungho Hwang, Yong-Jun Kim, “Wall loss reduction technique using an electrodynamic disturbance for airborne particle processing chip applications”, Journal of Micromechanics and Microengineering, vol. 20, pp. 035034, 2010. (IF=2.141) Link

Selected Conference Papers

  1. Min-gu Kim, Devin K. Brown, Oliver Brand, “Submicrometer-scale all-soft electronics based on liquid metal”, The 20th International Conference on Solid-State Sensors, Actuators, and Microsystems (TRANSDUCERS 2019), Berlin, Germany, Jun, 2019.
    • Oral presentation
  2. Pyungwoo Yeon, Min-gu Kim, Muhannad S. Bakir, Oliver Brand, Maysam Ghovanloo, “Automated high-throughput hermetic failure monitoring system for millimeter-sized wireless implantable medical devices”, The 20th International Conference on Solid-State Sensors, Actuators, and Microsystems (TRANSDUCERS 2019), Berlin, Germany, Jun, 2019.
  3. Devin K. Brown, Min-gu Kim, David R, Myers, Wilber A. Lam, Oliver Brand, “Nanoscale metallic resistors in soft polymers”, The 63rd International Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication (EIPBN 2019), Minnesota, USA, May, 2019.
    • Best Poster Award
  4. Min-gu Kim*, Byeongyong Lee*, Seung Woo Lee, Oliver Brand, “All-soft and liquid-phase supercapacitors based on CNT-integrated liquid metal electrodes”, MRS Fall Meeting and Exhibit (MRS Fall 2018), Boston, USA, USA, BM08.06.25, Nov, 2018. Accepted
    • Nominated for Best Poster Award
  5. Min-gu Kim, Choongsoon Kim, Hommod Alrowais, Patrick Getz, Oliver Brand, “Multiscale liquid metal thin-film patterning based on soft lithography for skin-mountable, soft and 3D-integrated biological microsystems”, Solid-State Sensors, Actuators and Microsystems Workshop (Hilton Head 2018), Hilton Head, USA, 42-45, Jun, 2018.
    • Oral presentation
    • Nominated for Best Paper Award and received Travel Grant
  6. Min-gu Kim, Oliver Brand, “All-soft and 3D-integrated functional microsystems enabled by gallium-based liquid metal and soft lithography”, 2018 Flex Conference, Monterey, CA, USA, Feb, 2018.
    • Invited Poster Presentation
    • Received Travel Grant
  7. Min-gu Kim, Oliver Brand, " Toward all-soft and fully-integrated microsystems: vertically integrated physical and chemical microsystems using gallium-based liquid metal and soft lithography", NEXTFLEX Workshop: Powering the Internet of Everything, Georgia Institute of Technology, GA, USA, Nov, 2017.
  8. Hommood Alrowais, Min-gu Kim, Oliver Brand, “Parylene-on-oil encapsulation process for bio-inspired angular accelerometer”, The 19th international conference on Solid-State Sensors, Actuators, and Microsystems (TRANSDUCERS 2017), Kaohsiung, Taiwan, 587-590, Jun, 2017. Link
    • Oral presentation
    • Received Travel Grant
  9. Choongsoon Kim, Patrick Getz, Min-gu Kim, Hommood Alrowais, Oliver Brand, “Room temperature CO2 sensing based on interdigitated capacitors and resonant cantilevers”, The 19th international conference on Solid-State Sensors, Actuators, and Microsystems (TRANSDUCERS 2017), Kaohsiung, Taiwan, 1532-1535, Jun, 2017. Link
  10. Min-gu Kim, Hommood Alrowais, Oliver Brand, “All-soft physical and chemical microsystems based on liquid metal for wearable electronics applications”, The 30th international conference on Micro Electro Mechanical Systems (IEEE MEMS 2017), Las Vegas, USA, 1162-1165, Jan, 2017. Link
    • Received Travel Grant
  11. Min-gu Kim, Hommood Alrowais, Choongsoon Kim, Oliver Brand, “All-soft sensing platform based on liquid metal for liquid- and gas-phase VOC detection”, IEEE Sensors Conference (IEEE Sensors 2016), Orlando, USA, 76-78, Oct-Nov, 2016. Link
    • Oral presentation
    • Received Best Oral Paper Award (3rd place) and Travel Grant
    • Featured in Georgia Tech ECE, IEN, and IEEE Sensors 2016.
  12. Choongsoon Kim, Spyridon Pavlidis, Min-gu Kim, Hang Chen, Oliver Brand, “Room temperature CO2 detection using interdigitated capacitors with heteropolysiloxane sensing films”, IEEE Sensors Conference (IEEE Sensors 2016), Orlando, USA, 190-192, Oct-Nov, 2016. Link
  13. Min-gu Kim, Hommod Alrowais, Spyridon Pavlidis, Oliver Brand, “Scalable liquid metal thin line patterning for passive electronic components using soft lithography”, Solid-State Sensors, Actuators and Microsystems Workshop (Hilton Head 2016), Hilton Head, USA, 62-63, Jun, 2016.
    • Oral presentation
    • Received Travel Grant
  14. Hommod Alrowais, Patrick Getz, Min-gu Kim, Jin-Jyh Su, Oliver Brand, “Bio-inspired fluidic thermal angular accelerometer”, The 29th international conference on Micro Electro Mechanical Systems (IEEE MEMS 2016), Shanghai, China, 761-764, Jan, 2016. Link
  15. Min-gu Kim, Tae-Won Park, Dong-Jin Hong, Joong-Kyung Kim, “Optimal thermal management with oil-forced flow and air-forced flow for power transformer applications”, Joint Colloquium of Cigré SC A2/C4 (CIGRE), Zurich, Switzerland, id101, Sep, 2013.
    • Corresponding Author
  16. Tae-Won Park, Seung-ho Lee, Min-gu Kim, Joong-Kyung Kim, “Analysis of thermal ageing characteristics of alternative dielectric fluids used in transformer applications with ON cooling condition”, Joint Colloquium of Cigré SC A2/C4 (CIGRE), Zurich, Switzerland, id102, Sep, 2013.
    • Oral Presentation
  17. Dong-Hyun Kang, Min-gu Kim, Hye-Kyung Seo, Yong-Jun Kim, “An anti-adhesion technique in microfluidic channel based on dielectrophoresis”, The 5th international conference on Nano/Molecular Medicine and Engineering (IEEE NANOMED 2011), Jeju, Korea, IP4-02, Nov, 2011.
  18. Yong-Hwan Choi, Dong-Hyun Kang, Seung-Il Yoon, Min-gu Kim, Jaesam Sim, Jongbaeg Kim, Yong-Jun Kim, "An electrodynamic preconcentrator-integrated thermoelectric biosensor chip for continuous monitoring", The 24th international conference on Micro Electro Mechanical Systems (IEEE MEMS 2011), Cancun, Mexico, 837-840, Jan, 2011. Link
  19. Min-gu Kim, Yong-Ho Kim, Chul Woo Park, Yun-Haeng Joe, Jungho Hwang, Yong-Jun Kim, “Electrodynamic wall loss reduction for airborne particle processing”, The 13th international conference on Miniaturized Systems for Chemistry and Life Sciences (μ TAS 2009), Jeju, Korea, 1928-1930, Nov, 2009.
    • Received Travel Grant
  20. Min-gu Kim, Yong-Ho Kim, Chul Woo Park, Jungho Hwang, Yong-Jun Kim, “An anti-adhesion technique reducing particle-loss using electrodynamic disturbance for aerodynamic chip”, The 15th international conference on Solid-state Sensors, Actuators & Microsystems (TRANSDUCERS 2009), Denver, USA, 405-408, Jun, 2009. Link

Others: Seminar and Poster

  1. Min-gu Kim, Oliver Brand, “Toward all-soft and fully-integrated microsystems for physical and chemical wearable sensing applications", 2017 Science and Technology of Advanced Materials and Interfaces (STAMI) Industrial Day and Expo, Georgia Institute of Technology, GA, USA, Oct, 2017.
  2. Min-gu Kim, Oliver Brand, “All-soft and 3D-integrated physical and chemical microsystems using gallium-based liquid metal”, Dickey Group, Department of Chemical and Biological Engineering, North Carolina State University, NC, USA, May, 2017.
  3. Min-gu Kim, Oliver Brand, “Towards all-soft and fully-integrated microsystems”, IEN (Institute for Electronics and Nanotechnology) Technical Exchange Conference on Micro/Nano-Enabled Electronics for Global Challenges, Georgia Institute of Technology, GA, USA, May, 2017.

Patents

  1. Min-gu Kim, Devin K. Brown, Oliver Brand, “Micro/nanofabrication for all-soft electronic devices based on gallium-based liquid metal”, US Patent Application, No. 62/864,571, filed 2019.
  2. Min-gu Kim, Oliver Brand, “Multiscale and uniform liquid metal thin-film patterning based on soft lithography for 3D heterogeneous integrated soft microsystems”, US Patent Application, No. 62/849,372, filed 2019.
  3. Min-gu Kim, Sang Moon Cho, “Transformer having air cooling type radiator”, Korean Application No. 102012133468 (2012), registration No. 1013845690000, 2014.
  4. Jingi Paeng, Min-gu Kim, “Radiator for transformer”, Korean Application No. 10-2012-0130297, 2012.
  5. Yong-Jun Kim, Jungho Hwang, Min-gu Kim, Chul Woo Park, Hong-Lae Kim, “Microfluidic chips and method of manufacturing the same, and microchannel and method of manufacturing the same”, Korean Registration No. 10-1183436, 2012.