4th International Conference on Signal Processing and Machine Learning (SIGML 2023) will provide an excellent international forum for sharing knowledge and results in theory, methodology and applications of on Signal Processing and Machine Learning. The aim of the conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet and share cutting-edge development in the field.

Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in the areas of Signal Processing and Machine Learning.

• Applied Digital Signal Processing

• Coding and Transmission

• Digital Signal Processing in Communications

• Emerging Technologies

• Emerging Technologies in Digital Signal Processing

• Image & Signal Processing Applications

• Image Acquisition and Display

• Image and Video Processing & Analysis

• Image Formation

• Image Scanning, Display and Printing

• Storage and Retrieval

• Computer Vision and Pattern Recognition

• Signal Processing for Internet of Things

• Machine Learning Applications

• Learning in knowledge-intensive systems

• Learning Methods and analysis

• Learning Problems

• Deep Learning

Authors are invited to submit papers through the conference Submission System by CLOSED. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by Computer Science Conference Proceedings in Computer Science & Information Technology (CS & IT) series (Confirmed).

Selected papers from SIGML 2023, after further revisions, will be published in the special issue of the following journals

• Machine Learning and Applications: An International Journal (MLAIJ)

• Signal & Image Processing : An International Journal (SIPIJ) - WJCI Indexed

• Information Technology in Industry (ITII)