Publications

M. Stanley, M. Celep, A. Elarabi, M. Salter, D. Singh, J. Skinner, S.-H. Shin and N. M. Ridler, "A Technique to Improve Accuracy of S-parameter Measurements of Coaxial Connectorized Devices at Cryogenic Temperatures," IEEE Transactions on Instrumentation and Measurement, 2025.

S.-H. Shin, J. Skinner, " Application of Weighting Algorithm for Enhanced Broadband Vector Network Analyzer Measurements," Mathematics, 2024 

S.-H. Shin, M. Stanley, W. N. Wong, T. Sweetnam,  A. Elarabi, T. Lindström, N. M. Ridler, S. E. de Graaf, "In-operando microwave scattering-parameter calibrated measurement of a Josephson traveling wave parametric amplifier," Applied Physics Letter. 2024

M. Celep, S. -H. Shin, M. Stanley, E. Breakenridge, S. Singh and N. Ridler, "SI Traceable RF and Microwave Power Measurements at Cryogenic Temperatures," 2024 Conference on Precision Electromagnetic Measurements (CPEM), Denver, CO, USA, 2024

Stanley M, Shang X, Celep M, M Salter, SE. de Graaf, T Lindstromm, S.-H. Shin, J Skinner, D Singh, D Stokes. "RF and microwave metrology for quantum computing – recent developments at the UK’s National Physical Laboratory," International Journal of Microwave and Wireless Technologies. 2024.

M. Stanley, M. Salter, J. Urbonas, J. Skinner, S.-H. Shin, SE. de Graaf, N.M Ridler, “Characterizing S-Parameters of Microwave Coaxial Devices with up to Four Ports at Temperatures of 3 K and Above for Quantum Computing Applications”, IEEE Transactions on Instrumentation and Measurement, 2024

S.-H. Shin, M. Stanley, J. Skinner, SE. de Graaf, N.M Ridler, “Broadband Coaxial S-Parameter Measurements for Cryogenic Quantum Technologies”, IEEE Transactions on Microwave Theory and Techniques, 2024

S.-H. Shin, X. Shang, D. Stokes, M. Acharya, T. Lindstrom, N. Ridler, "Designing Calibration Standards for Cryogenic On-wafer S-parameter Measurements," ARMMS, 2023

 L. Zhu, S.-H. Shin, R. Payapulli, I. Rossuck, N. Klein, N. Ridler and S. Lucyszyn, “3-D printed THz waveguide Components”, IEEE Acess, 2023.

L. Zhu, I. Rossuck, R. Payapulli, S.-H. Shin, and S. Lucyszyn, “3-D printed W-band waveguide twist with integrated filtering”, IEEE Microwave and Wireless Technology Letters, 2023. 

R. Payapulli, L. Zhu, S.-H. Shin, M. Stanley, N. M. Ridler, and S. Lucyszyn, “Polymer-based 3-D printed 140 to 220 GHz metal waveguide thru lines, twist and filters”, IEEE Access, 2023. 

L. Zhu, S.-H. Shin, R. Payapulli, T. Machii, M. Motoyoshi, N. Suematsu, N. M. Ridler, and S. Lucyszyn, “3-D printed rectangular waveguide 123-129 GHz packaging for commercial CMOS RFICs”, IEEE Microwave and Wireless Technology Letters,2023.

S.-H. Shin, R. Payapulli, L. Zhu, M. Stanley, X. Shang, N. M. Ridler, and S. Lucyszyn, “3-D printed plug and play prototyping for low-cost sub-THz subsystems”, IEEE Access,. 2022

 L. Zhu, R. Payapulli, S.-H. Shin, M. Stanley, N. M. Ridler, S. Lucyszyn, “3-D printing quantization predistortion applied to sub-THz chained-function filters”, IEEE Access, 2022.

E. Márquez-Segura, S.-H. Shin, A. Dawood, N. Ridler, and S. Lucyszyn, “Microwave characterization of conductive PLA and its application to a 12 to 18 GHz 3-D printed rotary vane attenuator” IEEE Access, 2021.

S.-H. Shin, X. Shang, N. M. Ridler, and S. Lucyszyn, “Polymer-based 3-D printed 140-220 GHz low-cost quasi-optical components and integrated subsystem assembly”, IEEE Access, 2021.

H. Ren, S.-H. Shin and S. Lucyszyn, “Enhanced cognitive demodulation with artificial intelligence”, Scientific Reports, Nature Publishing Group, 2020.

S.-H. Shin and S. Lucyszyn, “Benchmarking a commercial (sub-)THz focal plane array against a custom-built millimeter-wave single-pixel camera”, IEEE Access, vol. 8, 2020.

S.-H. Shin, D. Alyasiri, M. D’Auria, W. J. Otter, C. W. Myant, D. Stokes, Z. Tian, N. M. Ridler, and S. Lucyszyn, “Polymer-based 3-D printed Ku-band steerable phased-array antenna subsystem”, IEEE Access, 2019.