Welcome to SEAS 2023

12th International Conference on Software Engineering and Applications (SEAS 2023)

September 23 ~ 24, 2023, Toronto, Canada 


Hybrid -- Registered authors can present their work online or face to face New 

Program Committee

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Accepted Papers

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Venue

Toronto, Canada

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Scope Call for Participation Program Schedule

12th International Conference on Software Engineering and Applications (SEAS 2023) will provide an excellent international forum for sharing knowledge and results in theory, methodology and applications of Software Engineering and Applications.

Call for Papers


12th International Conference on Software Engineering and Applications (SEAS 2023) will provide an excellent international forum for sharing knowledge and results in theory, methodology and applications of Software Engineering and Applications. The goal of this conference is to bring together researchers and practitioners from academia and industry to focus on understanding Modern software engineering concepts and establishing new collaborations in these areas.


Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in the areas of software engineering & applications.


Topics of interest include, but are not limited to, the following



Paper Submission

Authors are invited to submit papers through the conference Submission System by Closed. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by Computer Science Conference Proceedings in Computer Science & Information Technology (CS & IT) series (Confirmed).

Proceedings

Hard copy of the proceedings will be distributed during the Conference. The softcopy will be available on AIRCC Digital Library

Speakers

DavidZhang

US 

Zhenai Wang

China 

Yize Wang

United States of America 

Sean Loesch

University of Wisconsin-Eau Claire

United States of America 

YANG ZHEN

China 

Julia Yili Shang

California State Polytechnic University

United States of America 

Tianche Du

United States of America 

Farbod Behnaminia

University of Windsor

Canada 

Senlin Yang

Palos Verdes Peninsula

USA 

Ming Yin

China 

Sponsers