Internship

An internship will be in Three Domain

  1. Hardware Implementation of DNN Accelerators

  2. CMOS design of In-Memory Computing Architecture for AL-ML applications

  3. Embedded System Design for IoT and Appliances


Major Outcomes of the Internship Project:


Hardware:

  • Importance of DNN in AI-ML applications

  • Why Hardware solution for DNN acceleration

  • Types of Hardware Chip Solutions for DNN Accelerator (ASIC, Custom-Layout CMOS chip, FPGA, RRAM-based Neuromorphic Chip)

  • Stages for Development of System-level DNN solution for AI application.

  • Limitations and Bottleneck in current solutions.

  • FPGAs and ASICs: Benefits, Limitations, and Outcomes.

  • System-level Integration of DNN accelerators.

  • Future Scope in DNN accelerator.



CMOS Design:

  • Design and Analysis of CMOS-based Logic Architecture.

  • Design and Simulation of SRAM memory Cell.

  • In-memory Computing Architecture for CNN computations 64x64 array if SRAM array of IMC

  • Circuit Optimization and results evaluation



Embedded Design:

  • Study of Rpi-4 and Arduino Board for ES development

  • Hardware interface study and understanding e.g SPI, UART, I2C, AXI, etc.

  • Analog Digital IC interface with Master Board

  • Design and Development of a Drone using a Micro-controller

  • Other Hardware interfaces such as 4G internet, GPS, Gyroscope, accelerometer, ADC and DAC, and other ICs-related signal modulation.



Based on the above subject, work will be assigned based on each project that will be carried out by Two students in collaboration.