Internship
An internship will be in Three Domain
Hardware Implementation of DNN Accelerators
CMOS design of In-Memory Computing Architecture for AL-ML applications
Embedded System Design for IoT and Appliances
Major Outcomes of the Internship Project:
Hardware:
Importance of DNN in AI-ML applications
Why Hardware solution for DNN acceleration
Types of Hardware Chip Solutions for DNN Accelerator (ASIC, Custom-Layout CMOS chip, FPGA, RRAM-based Neuromorphic Chip)
Stages for Development of System-level DNN solution for AI application.
Limitations and Bottleneck in current solutions.
FPGAs and ASICs: Benefits, Limitations, and Outcomes.
System-level Integration of DNN accelerators.
Future Scope in DNN accelerator.
CMOS Design:
Design and Analysis of CMOS-based Logic Architecture.
Design and Simulation of SRAM memory Cell.
In-memory Computing Architecture for CNN computations 64x64 array if SRAM array of IMC
Circuit Optimization and results evaluation
Embedded Design:
Study of Rpi-4 and Arduino Board for ES development
Hardware interface study and understanding e.g SPI, UART, I2C, AXI, etc.
Analog Digital IC interface with Master Board
Design and Development of a Drone using a Micro-controller
Other Hardware interfaces such as 4G internet, GPS, Gyroscope, accelerometer, ADC and DAC, and other ICs-related signal modulation.
Based on the above subject, work will be assigned based on each project that will be carried out by Two students in collaboration.