Call for papers on Focus issue of R2R printing foundry in

Flexible and Printed Electronics

Focus on R2R Printing Foundry for IoT and PoCT Guest Editors

SoYoung Kim, Sungkyunkwan University, Korea

Chloe Bois, I-CI, Montreal, Canada

Jukka Hast, VTT, Oulu, Finland

Taik-Min Lee, Korea Institute of Machinery and Materials, Korea

Gyoujin Cho, Sungkyunkwan University, Korea

Scope

As AI-based Big data becomes more ubiquitous towards elevating the quality of life, the demand for flexible, inexpensive and eco-friendly sensors, passive components, rectenna and micro-controllers have also been on the rise. In particular, IoT (Internet of Things) and PoCT (Point of Care Test) being developed for healthcare and security systems require such printed devices with multiple integrated components. However, the current Si-based foundry faces limitations with regards to in-line continuous packaging of these devices that require sensors, microfluidic chips, signage, passive components, to name a few. Furthermore, traditional rigid electronic parts and devices cannot provide a tailored sensors and functionalities that meet the requirements for a wide variety of IoT and PoCT products. Thus, a foundry based on a novel paradigm should be developed to meet both the production scale and cost demands of IoT and PoCT. In this issue, all subjects for developing Roll-to-Roll (R2R) printing foundry that is able to manufacture a variety of flexible electronic parts and devices with high throughput and low cost will be introduced as the best candidate to meet the demands of IoT and PoCT. To establish the R2R printing foundry, electronics inks, R2R ink transfer, overlay printing registration, web handling, drying, R2R inspection, chip design methodology and simulation, design of printed logic gates, amongst others should be reconsidered holistically in order to manufacture the disposable IoT and PoCT.

Topics of interest

• R2R printing process (ink transfer, drying, web handling, overlay printing registration accuracy)

• R2R inspection and characterization

• Printed devices for IoT including hybrid

• Printed devices for PoCT including hybrid

• Electronic inks

• Chip design methodology and simulation of printed devices

• Printed logic gates