Fully Automatic Die Bonder Equipment Market was valued at USD 1.50 Billion in 2022 and is projected to reach USD 2.30 Billion by 2030, growing at a CAGR of 6.5% from 2024 to 2030.
The global market for fully automatic die bonder equipment was valued at approximately USD 1.2 billion in 2022. It is projected to experience a robust growth rate with a compound annual growth rate (CAGR) of around 7.5% from 2023 to 2030. This growth is driven by the increasing demand for advanced semiconductor packaging technologies and the proliferation of electronic devices requiring high-precision bonding solutions. As industries such as automotive, consumer electronics, and telecommunications expand, the need for more efficient and reliable die bonding processes is expected to surge, further propelling market expansion.
Opportunities in the fully automatic die bonder equipment market are significant due to ongoing advancements in technology and the growing adoption of Industry 4.0 practices. Emerging markets, particularly in Asia-Pacific and Latin America, are witnessing substantial investments in semiconductor manufacturing and electronics assembly, which are anticipated to drive demand for these sophisticated systems. Additionally, the rise of new applications in areas such as wearable technology and medical devices presents new avenues for growth. Companies that innovate in automation and integration with digital solutions will likely gain a competitive edge in this dynamic market.
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Toray Engineering
FASFORD TECHNOLOGY
Besi
ASM Pacific Technology Limited (ASMPT)
Kulicke & Soffa Industries Inc.
Tresky AG
SHIBAURA MECHATRONICS CORPORATION
West Bond
Panasonic Corporation
MRSI Systems
SHINKAWA LTD.
Palomar Technologies
DIAS Automation
By the year 2030, the scale for growth in the market research industry is reported to be above 120 billion which further indicates its projected compound annual growth rate (CAGR), of more than 5.8% from 2023 to 2030. There have also been disruptions in the industry due to advancements in machine learning, artificial intelligence and data analytics There is predictive analysis and real time information about consumers which such technologies provide to the companies enabling them to make better and precise decisions. The Asia-Pacific region is expected to be a key driver of growth, accounting for more than 35% of total revenue growth. In addition, new innovative techniques such as mobile surveys, social listening, and online panels, which emphasize speed, precision, and customization, are also transforming this particular sector.
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Growing demand for below applications around the world has had a direct impact on the growth of the Global Fully Automatic Die Bonder Equipment Market
Die Bonder Equipment for Integrated Device Manufacturers (DMs)
Die Bonder Equipment for Outsourced Semiconductor Assembly and Test (OSAT)
Based on Types the Market is categorized into Below types that held the largest Fully Automatic Die Bonder Equipment market share In 2023.
Epoxy Die Bonder
Eutectic Die Bonder
Soft Solder Die Bonder
Flip Chip Die Bonder
Global (United States, Global and Mexico)
Europe (Germany, UK, France, Italy, Russia, Turkey, etc.)
Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam)
South America (Brazil, Argentina, Columbia, etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
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1. Introduction of the Global Fully Automatic Die Bonder Equipment Market
Overview of the Market
Scope of Report
Assumptions
2. Executive Summary
3. Research Methodology of Verified Market Reports
Data Mining
Validation
Primary Interviews
List of Data Sources
4. Global Fully Automatic Die Bonder Equipment Market Outlook
Overview
Market Dynamics
Drivers
Restraints
Opportunities
Porters Five Force Model
Value Chain Analysis
5. Global Fully Automatic Die Bonder Equipment Market, By Type
6. Global Fully Automatic Die Bonder Equipment Market, By Application
7. Global Fully Automatic Die Bonder Equipment Market, By Geography
Global
Europe
Asia Pacific
Rest of the World
8. Global Fully Automatic Die Bonder Equipment Market Competitive Landscape
Overview
Company Market Ranking
Key Development Strategies
9. Company Profiles
10. Appendix
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