Plasma cleaning is one of the well-liked techniques for surface cleaning of substrates in material research and device fabrication. It is a dry, solvent free technology used to precision clean substrates at the molecular level. As plasma cleaning is a dry process there are none of the problems related to wet chemistry, for example exposure, chemical storage and waste removal, fitness and security limitations on the use of unsafe solvents, solvent combination into product, etc. This is the reason that plasma cleaning has earned itself the status “The green alternative to solvent cleaning”.

At PVA Tepla America, one can accomplish and carry on surface cleanliness at the molecular level during manufacturing extraordinary methodologies. Gas plasma cleaning removes surface contagion at the molecular level following machining, tooling and wet chemical dealing out steps. Plasma precision cleaning is a conformal process, not only for substrates of complex geometries but also on textured surfaces with “rough” topographies.

In addition, PVA Tepla America offers contract processing services for precision plasma cleaning. Our techniques have been implemented for over 40 years. Our gas plasma technology is commonly used to precision clean and activates, clean up surfaces, promote adhesion of efficient bio-molecules and in conjunction with precise chemical vapors sterilize in-vivo and in-vitro medical devices precision cleaning is a requirement for a broad spectrum of industries with applications ranging from semiconductor wafer cleaning in micro-electronics to bio-burden decontamination of medical devices.

Plasma can be termed as “the fourth state of matter” since it is not a liquid, a solid, or a gas. It exists in the form of ions and electrons. It is generally an ionized gas that has been electrified with supplementary electrons in both negative and positive states. Plasma Surface Treatment uses controlled vacuum plasma to alter the surface of a material in order to improve bonding, printing, painting, coating, or wet ability. The process is performed in a plasma chamber under vacuum pressure. It is commonly used in the manufacturing of electronic devices, medical devices, textiles, plastics, rubbers, and more. Nearly any dry material can be treated in a plasma chamber.

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