INTERNATIONAL CONFERENCE ON
“GLOBAL SEMICONDUCTOR NEXUS”
GSN 2026
Organized by
Department of Electronics and Communication Engineering
About the Conference
The International Conference on “Global Semiconductor Nexus” aims to bring together researchers, academicians, industry leaders, policymakers, and students to deliberate on the latest advancements, challenges, and opportunities in the semiconductor ecosystem. The conference will provide a platform to exchange knowledge, ideas, and research outcomes that can shape the future of semiconductor technology and its impact on electronics, communication, computing, and sustainable development.
With the global demand for semiconductors driving innovation in Artificial Intelligence, 5G/6G, Industry 5.0, Electric Vehicles, IoT, Healthcare, and Green Technologies, this conference seeks to explore new paradigms in semiconductor design, fabrication, supply chains, and policies that ensure resilience, sustainability, and inclusivity.
Sub Themes
AI, IoT, and edge computing applications
Advanced SoC and VLSI design
Hardware security and cryptographic chips
Trusted semiconductor design and manufacturing
Energy-efficient materials and devices
Green fabrication and recycling technologies
5G/6G enabled semiconductor solutions
Quantum computing and emerging devices
Novel materials (2D, graphene, wide-bandgap)
Nanoelectronics and MEMS/NEMS
Advanced testing methodologies
3D packaging and heterogeneous integration
Healthcare & Safety
Sustainable Infrastructure
Paper Submission Guidelines
Authors are invited to submit original and unpublished research papers in MS Word format, prepared in Times New Roman, 12 font 1.5 line spacing and margins of 1 inch on all sides. Papers should be between 4,000–6,000 words (maximum 12 pages) and include all standard sections such as Title, Abstract, Keywords, Introduction, Literature Review, Methodology, Results, Discussion, Conclusion, and References. The abstract (not exceeding 300 words) should briefly outline the purpose, methodology, key findings, and conclusions, followed by 4–6 keywords.
Bank Details:
Name : Prince Shri Venkateshwara Padmavathy Engineering College
Bank Name: ICICI Bank
IFSC Code : ICIC0001039
Account number: 103901003087
(One Zero Three Nine Zero One Zero Zero Three Zero Eight Seven)
Publications
Selected papers presented at the conference will be published in Scopus indexed journals
Assistant professor
Department of Material Science and Engineering, National Cheng Kung University
Taiwan
Dr.Su-Wen Hsu
(許素文 )
Associate Professor, Department of Chemical Engineering
National Cheng Kung University
Taiwan
Professor
Department of Engineering Science and Ocean Engineering
Graduate School of Advanced Technology
National Taiwan University
Taiwan
(蘇郁昇博士 )
International College of Semiconductor Technology, National Yang Ming Chiao Tung University, Taiwan
An International Conference Bridging Academia and Industry for Semiconductor Innovation
In Collaboration with Academia and Industry Experts from Taiwan
Contact Details :
Ms.Latha Muthukumaran
Director, Centre for International Affairs
Prince Shri Venkateshwara Padmavathy Engineering College
Dr.X.Mercilin Raajini M.E.,Ph.D.
Professor, Department of Electronics and Communication Engineering
Prince Shri Venkateshwara Padmavathy Engineering College