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This webpage was created as a part of PMRF programme to showcase my research and related outcomes. I worked on the development of enhanced flat thermosyphon heat sinks.
Academic Background
B.Tech in Mechanical Engineering - NIT Trichy, 2018.
MS+PhD in Thermal Engineering - IIT Madras (PMRF), 2024
Research area: Thermosyphon, Pool Boiling, Surface wettability, Pulsating heat pipe, Vapor Chamber.
Advisor: Dr. Arvind Pattamatta Website: https://www.mt2rl.in
Co-Advisor: Dr. Pallab Sinha Mahapatra Website: https://home.iitm.ac.in/pallab/
Interests
Thermal management of electronics, multi-scale cooling techniques, semiconductor manufacturing, and electronic packaging.
Heat Pipes, Thermosyphon, Pulsating heat pipe, Vapor Chamber, and Phase change heat transfer.
Heat transfer in mini channels, Micro-scale heat transfer, Surface wettability, and Microfluidics.
Details of the research project
Details of the research project
The advances in higher functionality electronics and simultaneous miniaturization results drastic increase in the heat rejected by electronic components (Refer Fig.1). Therefore, superior cooling techniques are required to protect the critical components from thermal failure. Phase change heat transfer, boiling and condensation with high transfer coefficients looks promising for the future needs as their high latent energy can be capitalized. Thermosyphons are wickless passive heat transfer devices that utilize liquid-vapor phase change for heat transfer, and gravity for working fluid transport . Surface wettability influences the phase change phenomena on a substrate, and appropriate surface wettability modifications can be used to enhance the boiling and condensation. For boiling, superhydrophobic surfaces promote nucleation, and superhydrophilic surfaces increase critical heat flux, whereas for condensation, superhydrophilic surfaces enhance nucleation, and superhydrophobic surfaces promote dropwise condensation. Hence, appropriate surface wettability modifications can be applied to liquid-vapor phase change heat transfer devices to improve their performance. The motivation of the research project is illustrated in Fig. 1. The project involves the thermal performance improvement of a flat thermosyphon through enhancement of boiling and condensation by surface modifications. The surface modifications include surface wettability and surface structuring of condenser and evaporator sections of the thermsyphon.
The main objectives of the project are:
To improve the heat sink performance in a datacenter rack server cooling using a flat thermosyphon with enhanced performance.
To get insights into the thermal performance of a two-phase flat thermosyphon.
To get insights into pool boiling heat transfer on minichannels.
Figure 1: Motivation - Current trend in electronics cooling and need for superior cooling techniques.
Development of enhanced flat thermosyphon heat sinks
Please refer to the thesis for more details.
https://drive.google.com/file/d/19ABmGWkgT0Tg7ONFNZ9zus4c9hQPfb19/view
Outcomes
Journal Papers:
P. Dhanalakota, S. Abraham, P. S. Mahapatra, B. Sammakia, A. Pattamatta, Thermal performance of a two-phase flat thermosyphon with surface wettability modifications, Applied ThermalEngineering (2021), doi: https://doi.org/10.1016/j.applthermaleng.2021.117862
P. Dhanalakota, L.K. Malla, H. Dileep, P.S. Mahapatra, A.Pattamatta, Effective thermal management of heat sources in sustainable energy devices using a compact flat thermosyphon, Energy Convers. Manag. 268 (2022) 116041. https://doi.org/10.1016/j.enconman.2022.116041.
P. Dhanalakota, H. Dileep, L.K. Malla, P.S. Mahapatra, A. Pattamatta, A novel integrated flat thermosyphon heat sink for energy-efficient chip-level thermal management in data centers, Appl. Therm. Eng. 236 (2024) 121667. https://doi.org/10.1016/j.applthermaleng.2023.121667.
L.K. Malla, P. Dhanalakota, P.S. Mahapatra, A. Pattamatta, Thermal and flow characteristics in a flat plate pulsating heat pipe with ethanol-water mixtures: From slug-plug to droplet oscillations, Int. J. Heat Mass Transf. 194 (2022) 123066. https://doi.org/10.1016/j.ijheatmasstransfer.2022.123066
Patents:
P. Dhanalakota, H. Dileep, L.K. Malla, P. S. Mahapatra, A. Pattamatta, “A system and method for efficiently transferring heat from a heat source”, Indian Patent Number: 468268.
Conference papers:
P. Dhanalakota, P.S. Mahapatra, A. Pattamatta, Effect of Subcooling on Pool Boiling Heat Transfer Over Minichannel Surfaces, in: ASME Int. Mech. Eng. Congr. Expo., American Society of Mechanical Engineers, 2021: p. V011T11A033, doi: https://doi.org/10.1115/IMECE2021-73455
P. Dhanalakota, L.K. Malla, P.S. Mahapatra, A. Pattamatta, Numerical modeling of the thermal performance of a two-phase flat thermosyphon, in: Proc. 26thNational 4th Int. ISHMT-ASTFE Heat Mass Transf. Conf. December 17-20, 2021, IIT Madras, Chennai-600036, Tamil Nadu, India, Begel House Inc., 2021. doi: 10.1615/IHMTC-2021.1370
L.K. Malla, P. Dhanalakota, P.S. Mahapatra, A. Pattamatta, Thermal Performance of a Closed-Loop Flat Plate Pulsating Heat Pipe Filled with Water-based Binary Mixtures, in: Proc. 26thNational 4th Int. ISHMT-ASTFE Heat Mass Transf. Conf. December 17-20, 2021, IIT Madras, Chennai-600036, Tamil Nadu, India, Begel House Inc., 2021. doi: 10.1615/IHMTC-2021.1210
Course work
Advanced heat and mass transfer. (Grade -S)
Boiling, Condensation and Two-phase flow. (Grade -A)
Computational heat and fluid flow. (Grade -S)
Capillarity and wetting phenomena. (Grade -A)
Measurements in thermal engineering. (Grade -A)
Convective heat transfer. (Grade -S)
Incompressible fluid flow. (Grade -A)
Surfaces and interfaces. (Grade -S)
Introduction to research.
Special Topics in Mechanical Engineering - ME 6999 (Grade - A)
Special Topics in Mechanical Engineering - ME 7999 (Grade - A)
TOTAL CGPA: 9.4 out of 10
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