High speed PCB design is any design where the integrity of your signals begins to be impacted by physical characteristics of your PCB, such as layout, packaging, interconnection, as well as layer stackup and so on. What’s more, you will come into the world of high speed PCB design when you start to design the boards and get into troubles such as delays, crosstalk, reflections, or emissions.
High speed design is so unique because of the attention paid to these issues. You might be used to designing a simple PCB where you are mainly in paying attention to component placement and routing. However, it’s more important to take some factors into consideration when using a high speed design, such as how close they are to signals, what width they are going to be, where you are placing the traces, as well as what kinds of components they are connected. What’s more, it will achieve a great level for your PCB design process when you take the factors into considerations.
Emergence of India as a global economy has opened up a huge demand for electronic products. National Policy on Electronics and Make in India initiative of Government of India has resulted in setting up of many industries in the Electronics sector and has led to a huge demand for trained man power in Electronics Board Design.
Certificate Course on Electronics Board design and Bring up is offered to bridge the major gap in competencies required to design state-of-the art PCB and electronics products.
On successful completion of the Course, the Participants shall be able to
Analyze customer requirement and interpreting user needs
Verify to check if design is feasible to develop within the framework of the specification
Able to make an efficient Chip design which give the best performance, uses optimal power and in minimal area.
This course consist of four modules. The modules are as follows:
Module 1: Electronics Board Design Basics (1 Week )
Module 2: Multilayer PCB Design(1 Week)
Module 3: Introduction to High Speed Signaling (2 Week)
Module 4: Semiconductor Packages (1 Week)
Module 1: Electronics Board Design Basics (1 Week)
Evolution and Classification of Printed Circuit Boards, Challenges in Modern PCB, Design and Manufacturing, PCB fabrication, methodologies(SSB, DSB and multilayer board), PCB design considerations/ design rules for analog, digital and power applications, Electromagnetic interference in electronic systems and its impact Analysis of electronic circuit from noise emission point of view (both conducted and radiated emission) cross talk and reflection behavior of the circuit in time domain, Thermal management of electronic devices and systems.
Module 2: Multilayer PCB Design (1 Week)
Multilayer PCB design guide lines, Design of Multilayer PCB Stack-up, Differential pair routing, Length matching, Generation of different types of reports.
Module 3: Introduction to High Speed Signaling (2 Week)
Introduction to high speed PCB design, Signal Integrity, Power Integrity and Thermal Analysis, Power distribution and noise, Signaling convention, termination
Module 4: Semiconductor Packages (1 Week)
Single chip packages or modules. (SCM) Commonly used packages and advanced packages; Materials in packages, Current trends in Packaging, Multichip modules (MCM) - types; System-in package (SIP); Packaging roadmaps; Hybrid circuits.
B.E./B.Tech in Electronics/ Electronics & Communication/ Electrical/ Electrical and Electronics/Instrumentation/ Biomedical /Computer Science/Information Technology or MSc in Electronics/ Instrumentation/ Computer Science/Information Technology or Diploma in Electronics/CS/IT/EEE/EI.
For more details please get in touch with us infintyprolabs@gmail.com
For more Information please feel free to contact. (+91-8310774584)
This course covers all the important subjects you need to know for Advanced PCB Layout:
Placement (how to place CPU, memories, power supplies, connectors, protection, etc.)
Basic Rules & Basic Stackup (initial rules and stackup settings to start your layout)
Fanout under CPU (how to do placement and fanout in high-density areas)
DDR3 preliminary layout (deciding on how to use layers, pin & bank swapping, … )
Board fanout (how to do fanout, good practice and recommendations)
Planning Layout (how to plan layout for high speed interfaces, wide buses, power distribution, … )
Crosstalk (how to calculate and minimize crosstalk)
Impedances & Stackup (how to calculate impedance and decide on stackup)
High Speed Design Rules & Routing (recommendations & examples for high speed design layout)
Layer ordering (how to decide on layer ordering)
Number of layers (how to decide on number of layers)
Layout (recommendations on routing different peripherals & buses, Powers, … )
Length matching (DDR2/3, PCIE, HMDI, LVDS, GbE, … )
About memory routing (T-branch vs Fly-by topology, calibration, … )
Polygons & Power Planes (how to work with polygons & planes, what is important, useful rules, … )
Checking PCB (recommendations for checking your PCB)
Length tuning (differential pair length tuning, finishing memory layout, … )
Finishing PCB (adding useful information e.g. manufacturing notes, mechanical drawing layer)
Generating & Checking gerber files (how to generate gerber files, tips about how to check them, …. )