Research

Topic #1. Large-Area Synthesis of 2D Nanomaterials

We develop scalable synthesis techniques for 2D semiconducting nanomaterials, enabling high-quality thin films over wafer-scale areas. By integrating advanced post-treatment processes, we aim to realize materials optimized for next-generation electronic devices. 

[Representative Publications]

1. Advanced Materials 2023, 35, 2210715.

2. Communications Materials 2021, 2, 94.

3. ACS Applied Materials & Interfaces 2020, 12 (18), 20645-20652.

4. The Journal of Physical Chemistry C 2022, 126 (23), 9696-9703.

Topic #2. Quantum Band Structure Engineering 

We engineer band structures of nanomaterials through nanoscale patterning and doping techniques, enabling interesting control over electronic states and light–matter interactions. By tuning edge configurations and leveraging quantum confinement, we achieve new opportunities for advanced sensing and imaging technologies. 

[Representative Publications]

1. Advanced Functional Materials 2023, 33, 23301919.

2. Materials Today Nano 2023, 23, 100367.

3. NPJ 2D Materials and Applications 2022, 6, 21.

4. ACS Nano 2021, 16(2), 1826-1835.

Topic #3. Next-Generation Electronics and Sensors

We design a wide range of electronic devices using nanomaterials, spanning from FETs to sensors (phototransistors, gas sensors, biosensors, etc.), as well as memory devices for neuromorphic computing. By exploiting the unique properties of nanomaterials, we create multi-functional platforms for future electronics and integrated sensing systems. 

[Representative Publications]

1. ACS Nano 2023, 17(21), 21719-21729.

2. ACS Nano 2022, 16(6), 9267-9277.

3. Analytical chemistry 2019, 91(13), 8252-8258.

4. ACS Applied Materials & Interfaces 2017, 9(50), 43490-43497.

Topic #4. Device-to-System Integration of 2D Electronics

We integrate 2D electronic devices into functional circuit and architecture platforms, including monolithic 3D (M3D) logic–memory stacks, in-memory sensing modules, and active-matrix systems for imaging and multi-modal detection. By bridging device fabrication with circuit-level design, we create compact, high-performance, and multifunctional platforms for next-generation computing and sensing. 

[Representative Publications]

1. Advanced Materials 2023, 35, 2210715.

2. Communications Materials 2020, 1, 86.

3. Nano Research 2017, 10(3), 767-775.

4. Sensors 2018, 18(3), 921.