Journal

International Journals

• (Accepted) Minkyu Kang*, Namgyeong Kim*, Hyunwoo Nam, Tae Yeob Kang†, "Non-destructive AI-Based Crack Diagnosis of Surface-Mounted Devices with De-Embedded S-Parameter Patterns", IEEE TCPMT

• (In preparation) T. Y. Kang*, et al. "Nanostructure Deformation as a Mechanistic Link Between Strength Degradation and Electronic Response in Carbon Films", Journal of Material Chemistry C

• (In preparation) T. Y. Kang*, et al. "Visualization of Corrosion in Electrodes Using a Conditional Diffusion Model Trained on S-Parameters", IEEE Transactions on Industrial Electronics

• (In preparation) T. Y. Kang, et al. "Non-Invasive Diagnosis of Corrosion in Electronic Packages Using Smith Charts", IEEE Open Journal of Industrial Electronics Society

• Yonghwi Kim*, Jae-Bum Pyo, Tae Yeob Kang†, Taek-Soo Kim†. "Radio frequency response as a non-destructive readout associated with tensile-strength degradation in nanoporous carbon electrodes", Scientific Reports, 2026.

• Dong Jun Kim, Jin-Woo Lee, Kihyun Bae, Tae Yeob Kang, Boo Soo Ma, Bumjoon J. Kim, Taek-Soo Kim; Importance of Molecular Weight of Conjugated Polymer Thin Films on Thermomechanical Reliability of Stretchable Organic Semiconductors. Chem. Mater. 11 August 2026; 38 (15): 7687–7699. 

• Myoung Song, Seung Jin Oh, Sungho Suh, Tae Yeob Kang, Taek-Soo Kim. "Knowledge-guided strain-damage image correlation for diagnosing nonlinear mechanical behavior of freely stretched ultra-thin polymer films on water surface", Polymer Testing, 2026, 158, 109154. 

• Minkyu Kang*, Namgyeong Kim*, Hyunwoo Nam, Yong-Seok Lee, Hak-Jun Lee, Tae Yeob Kang†. "Crack Diagnosis of Surface Mounted Devices by Deep Learning with Impedance Spectra", Electronics, 2025, 14(21), 4293

• Min, Kyuhae., Kang, Taejun., Kang, Tae Yeob†., & Pyo, Jae-Bum†. "Evaluation of Leakage Currents of Semiconductor Packages Due to High-Voltage Stress Under an Immersion Cooling Environment." Applied Sciences 15.9 (2025): 4668.

• Kang, Tae Yeob*, and Seunghyeok Hong. "Non-Invasive Quantification of Corrosion in Cu Interconnects Using Regression Models With S-Parameters." IEEE Access (2025).

• Kang, Tae Yeob*, et al. "On-Chip Sensor for Monitoring Crack Propagation in Solder Joints Using RF Signals: Electrical Modeling and Circuit Design." IEEE Sensors Letters 8.10 (2024): 1-4.

• Kang, Tae Yeob*, Haebom Lee, and Sungho Suh. "Learning Signal Patterns of Reflection Coefficient for Non-destructive Fault Diagnosis of Electronic Interconnects." Microelectronics Reliability 162 (2024): 115518.

• Kang, Tae Yeob*, Haebom Lee, and Sungho Suh. "An Empirical Study on Fault Detection and Root Cause Analysis of Indium Tin Oxide Electrodes by Processing S-Parameter Patterns." IEEE Transactions on Device and Materials Reliability 24.3 (2024): 380-389. 

• Kang, Tae Yeob*, et al. "Quantification of performance variation and crack evolution of bond-wire interconnects under harsh temperature environments by S-parameter analysis." IEEE Transactions on Components, Packaging and Manufacturing Technology 11.6 (2021): 990-998. 

• Yoon, Taeshik, Kang, Sumin, Kang, Tae Yeob, Kim, Taek-Soo. "Detection of graphene cracks by electromagnetic induction, insensitive to doping level." Computer Modeling in Engineering & Sciences 120.2 (2019): 351-361. 

• Lee, Hae-Suk, Tae-Yeob Kang, and Jun-Hee Hong. "Development of a muffler for 40 mm medium caliber gun: Numerical analysis and validation." International Journal of Precision Engineering and Manufacturing 19.2 (2018): 245-250. 

• Sangbong Lee, Donggeon Lee, Myungjun Kim, Taeyeop Kang, Sooyong Lee & Jungsun Park. "Correlation between mechanical properties degradation and discoloration of epoxy polymer by solar radiation exposure." International Journal of Aeronautical and Space Sciences 19.4 (2018): 843-854. 

• Choo, Kyosung, Tae Yeob Kang, and Sung Jin Kim. "The effect of inclination on impinging jets at small nozzle-to-plate spacing." International Journal of Heat and Mass Transfer 55.13-14 (2012): 3327-3334. 

• Sung-Dae Kim, Sang-Hwa Baek, Tae-Yeob Kang, So-Jin Park, Chulju Kim & Han Seo Ko. "Numerical analysis of flow distribution for combined weapon system in environmental tester." Journal of mechanical science and technology 26.10 (2012): 3339-3345.

Domestic Journals

• (Accepted) Insub Yoon, Tae Yeob Kang, "Degradation Diagnosis of Porous Carbon Film Electrodes Using a Random Forest Model Based on Impedance Spectra", Journal of applied reliability 

• Myoung Song, Boyeon Kim, Tae Yeob Kang, Taek-Soo Kim, and Boo Soo Ma, "Thermomechanical Stress Field Prediction of Package Interconnects Using U-Net with an Auxiliary Min-Max Head", Journal of the Microelectronics and Packaging Society, vol. 33, no. 1, pp. 51-66, 2026

• Minkyu Kang*, Namgyeong Kim*, Hyunwoo Nam, Changhyun Kwon, Sanbok Song, Tae Yeob Kang†, "A Study on Sonar Image Simulation Techniques for Remote-Controlled Unmanned Mine Disposal Vehicle Training", Korea Academia-Industrial cooperation Society, vol. 27, no. 1, pp. 259-267, 2026

• Minkyu Kang*, Namgyeong Kim*, Hyunwoo Nam, and Tae Yeob Kang†, "Crack Diagnosis for SMD Capacitors Using Deep Learning with Impedance Spectra", Journal of the Microelectronics and Packaging Society, vol. 32, no. 2, pp. 83-92, 2025

• Minkyu Kang*, Namgyeong Kim*, Hyunwoo Nam, and Tae Yeob Kang†, "Nondestructive Quantification of Corrosion in Cu Interconnects Using Smith Charts", Journal of the Microelectronics and Packaging Society, vol. 31, no. 2, pp. 28-35, 2024

• Byeongcheol Choe and Tae Yeob Kang†. "Reliability Assessment of Solder Joints Using Electrical Model on Cracking and S-Parameter Pattern Analysis." Journal of Applied Reliability, vol. 23, no. 1, 2023, 32-42.

• Tae Yeob Kang* and Taek-Soo Kim. "Signal-Based Fault Detection and Diagnosis on Electronic Packaging and Applications of Artificial Intelligence Techniques." Jornal of the Microelectronics and Packaging Society, vol. 30, no. 1, 2023, 30-41.

• Tae Yeob Kang* et al. "Design Guideline for Non-Accelerated Life Testing on Components of Defense Systems by Modifying MIL-STD-810 Testing Profiles." Journal of Applied Reliability, vol. 21, no. 1, 2021, 69-78.

• Donghwan Seo, Tae Yeob Kang et al. "The defect detection circuit of an electronic circuit through impedance change detection that induces a change in S-parameter." Journal of IKEEE, vol. 25, no. 4, 2021, 689-696.

• Donghwan Seo, Tae Yeob Kang et al. "A Method of Reliability Demonstration Test Design For Missiles Stored in an Ammunition Igloo Without Maintenance." Journal of Applied Reliability, vol. 19, no. 2, 2019, 114-122.

• Tae Yeob Kang*. "Development of Rain Test Equipment by Optical Measurement and a Precipitation-Flow Rate Calibration System." Journal of the Korean Society of Mechanical Technology, vol. 18, no. 3, 2016, 460-466.

• Dong-Geon Lee, Sang-Bong Lee, Myung-June Kim, Jung-Sun Park, Soo-Yong Lee and Tae-Yeob Kang. "Effect of Solar Radiation Aging on the Properties of Epoxy Polymers." Journal of the Korean Society for Aeronautical & Space Sciences, vol. 44, no. 9, 2016, 769-774.