Advanced Organic Semiconductor Laboratory
at Soft Hybrid Materials Center, Korea Institute of Science and Technology
at Soft Hybrid Materials Center, Korea Institute of Science and Technology
We have openings for motivated and creative researchers who are passionate about doing research in future semiconductor technologies based on organic semiconductor materials!
Contact Info. : jalim@kist.re.kr
Research Interest
With the advent of big data, artificial intelligence, the Internet of Things (IoT), and the pandemic era, the development of next-generation semiconductor technology goes beyond the limits of silicon semiconductors. Alongside the development of new concepts such as neuromorphic and optical computing, which are characterized by ultra-low power consumption and high performance, there is a research focus on developing flexible wearable/IoT smart semiconductor devices.
Based on research capabilities encompassing organic/polymeric semiconductor materials, processes, and devices, our research group aims to conduct research to lead the next-generation semiconductor technology through a new leap in organic semiconductor material technology.
Organic semiconductors can easily control electrical, chemical, and optical properties based on the chemical structure of molecules and their self-assembled nanostructures. They offer new possibilities for the development of next-generation semiconductor devices that are challenging to implement with conventional silicon semiconductor technology due to various chemical interactions, excellent absorption and photovoltaic conversion characteristics, physical flexibility, and the potential for printing processes.
In particular, research on organic semiconductors for next-generation semiconductors requires interdisciplinary research combining nanomaterials basic science and IT applied engineering throughout the entire research process, including molecular-level chemical structures, self-assembled nanostructuring, interpretation of optical/physical/electronic properties, device design and fabrication, process development, and final application technology implementation.