Research field
Wafer process group
Wafer front - end processing
Double wire sawing process
Double / Single face lapping process
Chemical mechanical polishing process
Wafer back - end processing
Copper wire Chemical mechanical polishing process
Hrbrid energy wafer processing
Pad measurement system development
Dressing track simulation and analysis
Sphere international prototype of kilogram development
Molding process group
Injection molding
MICM / VICM for HOE
AAO moliding
Secondary optics component
Polymer composites molding
Screw design and analysis
PLA / HA molding
Biodegradable Pulp composites
Photoelastic stress analysis