Plasma and Surface Engineering Laboratory

Department of Mechanical and Computer-Aided Engineering ,National Formosa University

DIRECTOR

Yin-Yu Chang

Professor, Dr.

Phone:+886-5-6315332

Cell-Phone:+886-933-549496

Lab Phone: +886-5-6315967

Fax:+886-5-6315310

Research outline

The Plasma and Surface Engineering Laboratory (PSEL) is a multi-disciplinary laboratory that serves as a focal point for industry-driven research and education in advanced thin films and coating systems, surface engineering, micro- and nano-mechanical, tribological and protective materials. The research is focused on understanding and controlling thin film growth and on surface and interface engineering, as well as on the metrology of coating properties for their applications in different areas such as mechanical, aerospace, biomedical, automobile industry, security and others.

Hardness and maximum useful temperature of steel, WC-Co and different hard coatings developed by PSEL.

*TEM micrographs of nanocomposite AlTiSiN and multilayered TiAlN/ZrN hard coatings.

*SEM micrographs of antibacterial TaN-Ag thin films and their antibacterial peroformance to S. aureus.

Awards

  1. Excellent academic research award of NFU, 2018.
  2. The Best Poster Award, TACT2017 International Thin Films Conference.
  3. The Merit Prize of the Poster Award, TACT2016 Thin Films Conference.
  4. The Excellence Prize of the Poster Award, TACT2015 Thin Films International Conference.
  5. Excellent academic research award of NFU, 2015.
  6. The Excellence Prize of the Poster Award, TVS-2012 Annual Symposium.
  • Program chair, TACT 2019 International Thin Films Conference.
  • Session Chair, Symposium B Hard Coatings and Vapor Deposition Technologies, Session B6. Coating Design and Architectures, ICMCTF (2020~2023).
  • Symposium Chair, Symposium G Surface Engineering - Applied research and industrial applications, ICMCTF (2016~2018).
  • Symposium Chair, Symposium B Nanostructured and nanocomposite coatings, TACT2017.
  • Vice President, Taiwan Association for Coating and Thin Film Technology(TACT) /2018-2019.

Latest Patents

US 7523914 B2, High-hardness and corrosion-tolerant integrated circuit packing mold.

M562214, 異種供料系統. Cooperated with NATIONAL CHUNG-HSING UNIVERSITY. 2018/06/21~2028/2/13. MOST 106-2218-E-005-003.